Micro-granular delay testing of configurable ICs

ABSTRACT

A method for testing a set of circuitry in an integrated circuit (IC) is described. The IC includes multiple configurable circuits for configurably performing multiple operations. The method configures the IC to operate in a user mode with a set of test paths that satisfies a set of evaluation criteria. Each test path includes a controllable storage element for controllably storing a signal that the storage element receives. The method operates the IC in user mode. The method reads the values stored in the storage elements to determine whether the set of circuitry is operating within specified performance limits.

CLAIM OF BENEFIT TO PRIOR APPLICATIONS

This Application is a continuation application of U.S. patentapplication Ser. No. 13/291,095, filed Nov. 7, 2011, now published asU.S. Publication 2012/0112786. U.S. patent application Ser. No.13/291,095 is a continuation application of U.S. patent application Ser.No. 12/785,484, filed May 23, 2010, now issued as U.S. Pat. No.8,072,234. U.S. patent application Ser. No. 12/785,484 claims thebenefit of U.S. Provisional Patent Application 61/244,425, filed on Sep.21, 2009 and U.S. Provisional Patent Application 61/320,692, filed onApr. 2, 2010. U.S. patent application Ser. No. 13/291,095, now publishedas U.S. Publication 2012/0112786, U.S. Pat. No. 8,072,234, and U.S.Provisional Patent Applications 61/244,425 and 61/320,692 areincorporated herein by reference.

BACKGROUND

Configurable integrated circuits (“ICs”) can be used to implementcircuit functionality designed by a user (“user design”) on an ICwithout having to fabricate a new IC for each design. One example of aconfigurable IC is a field programmable gate array (“FPGA”). Aconfigurable IC has several circuits for performing differentoperations. Configurable circuits can be configured by configurationdata to perform a variety of different operations. These circuits canrange from logic circuits (e.g., configurable look-up tables, or “LUTs”)to interconnect circuits (e.g., configurable multiplexers). The circuitsof a configurable IC are often made up of a multitude of transistors,metal and/or polysilicon wires, and/or other elements (e.g., capacitors,resistors, etc.).

During the manufacture of a configurable IC it is possible for flaws toaffect the operation of the IC. In addition to flaws, configurable ICsthat use minimum width (or near-minimum width) transistors for aparticular manufacturing technology are subject to large transistor totransistor variation. These variations can cause individual transistorsto operate more slowly than required. In some cases the flaws and/orvariations are manifested as malfunctioning circuit elements (e.g.,stuck outputs). In other cases, the flaws and/or variations aremanifested as substandard performance (e.g., excessive propagationdelay). Any slow or non-functioning circuit element may potentiallyrender the configurable IC unusable. Thus, all transistors and wiresmust be tested on every configurable IC to guarantee that the IC isproperly functioning.

Traditional test techniques aggregate the performance of a large numberof transistors and wires together into a single measurement. Thus, whensome transistors and/or wires are faster than the specified performancelimit while a single transistor is slower it is possible for a path thatincludes the slow transistor to pass the test criteria. This phenomenonis of particular concern in programmable logic because the performancepath may be extremely variable (due to the wide variability in end-userdesigns) and is typically not the same path that is used to test the IC.

Existing IC test methods (e.g., “scan” testing that uses automatic testpattern generation or “ATPG”) measure performance by propagating asingle edge through the circuit under test. In contrast, when operatingin user mode, a configurable IC will have multiple operational pathsand/or circuits, typically operating at a high switching rate (measuredin MHz or GHz). When running at a high switching rate, the power supplyto the transistors in the IC will be stressed, the temperature of thecircuit will be elevated, and the on-chip decoupling capacitors will becharging and discharging. The effect of these stresses on theperformance of the IC are not fully measured using traditional IC testmethods.

BRIEF DESCRIPTION OF THE DRAWINGS

The novel features of the invention are set forth in the appendedclaims. However, for purpose of explanation, several embodiments of theinvention are set forth in the following figures.

FIG. 1 illustrates a conceptual process used by some embodiments toperform launch-capture testing of a configurable IC.

FIG. 2 conceptually illustrates a configurable IC, tested by someembodiments, that includes numerous configurable circuits and numerousconnections among the circuits.

FIG. 3A conceptually illustrates an example of a configurable IC, testedby some embodiments, that includes numerous configurable circuits.

FIG. 3B illustrates several examples of different types of configurablestorage elements that can be located throughout the routing fabric of aconfigurable IC.

FIG. 4 illustrates the loading of configuration data onto a configurableIC of some embodiments.

FIG. 5 conceptually illustrates an example set of operations of an ICthat includes reconfigurable circuits that are sub-cycle reconfigurable(i.e., an IC that includes circuits that are reconfigurable on asub-cycle basis).

FIG. 6 illustrates an automated test system that is used to implementlaunch-capture testing in some embodiments.

FIG. 7 conceptually illustrates a launch-capture circuit as used toevaluate a section of IC circuitry in some embodiments.

FIG. 8 illustrates several example clock signals used by someembodiments.

FIG. 9 illustrates one example of a launch-capture circuit, of someembodiments, that uses multiple clock domains.

FIG. 10 illustrates one example circuit that may be used to generatephase-shifted clock signals in some embodiments.

FIG. 11 illustrates a conceptual process used by some embodiments toperform launch-capture testing of an IC.

FIG. 12 illustrates one example of a launch element of some embodiments.

FIG. 13 illustrates another example of a launch element of someembodiments.

FIG. 14 illustrates an example of a capture element of some embodiments.

FIG. 15 illustrates another example of a capture element of someembodiments.

FIG. 16 illustrates an exemplary launch-capture test circuit and anassociated state table of some embodiments.

FIG. 17 illustrates another exemplary launch-capture circuit and anassociated state table of some embodiments.

FIG. 18 illustrates another exemplary launch-capture circuit and anassociated state table of some embodiments.

FIG. 19 illustrates one example monitor circuit that may be used in someembodiments to determine in which sub-cycle the IC under test endedoperation.

FIG. 20 illustrates a conceptual process that may be used by someembodiments to control sub-cycle monitor circuitry such as that shown inFIG. 19.

FIG. 21 illustrates an exemplary launch-capture test circuit of someembodiments that includes the elements of launch-capture circuit of FIG.16 with additional components to enable fault isolation.

FIG. 22 illustrates a circuit that may be further in some embodimentsevaluated when the circuit has been determined to be malfunctioning.

FIG. 23 illustrates a transistor-level example of using fault isolationto identify a failing path or transistor within a malfunctioningelement.

FIG. 24 illustrates a conceptual process for performing fault isolationanalysis in some embodiments.

FIG. 25 illustrates a conceptual process used by some embodiments togenerate a set of test vectors to be used when performing launch-capturetesting.

FIG. 26 illustrates a conceptual diagram showing one possibleimplementation of a launch-capture test generation module.

FIG. 27 illustrates a computer system with which some embodiments of theinvention are implemented.

BRIEF SUMMARY

A method of testing a configurable integrated circuit (“IC”) is providedby some embodiments. Such configurable ICs may have a primary circuitstructure including configurable logic circuits for configurablyperforming logic functions, a configurable routing fabric forconfigurably connecting the circuits of the IC, and/or configurablestorage elements placed throughout the configurable routing fabric forconfigurably storing signals passed along the routing fabric. Inaddition these configurable ICs may have a secondary circuit structureincluding a configuration/debug network (alternatively referred to as a“configuration network” or “debug network”) for configuring theconfigurable circuits of the IC, where the configurable storage elementsand/or other circuit elements are accessible through the configurationnetwork.

In such an environment, the configurable storage elements provideplentiful configurable “capture” elements that are able to store data atvarious points along a test path, thus breaking a long signal path intomultiple smaller paths and allowing micro-granular testing ofsignal-path delay. The data stored by the capture elements may be readout using the configuration/debug network in order to verify theoperation of the IC.

In addition to such capture elements, several configurable logiccircuits (and/or other circuits) provide a number of “launch” elementsthat are able to generate test stimulus, where the stimulus is providedto various circuitry under test. In addition to the launch and captureelements, various other circuitry of the IC (e.g., configurable routingcircuits) provide a set of configurable test paths that connect launchelements and capture elements during test.

The test method (1) loads configuration data to the configurablecircuits to specify the desired operation of the configurable circuitsduring test, (2) configures the configuration/debug network to allowaccess to the desired test points (e.g., capture elements) within theIC, (3) operates the IC in “user” mode to exercise the circuitry (i.e.,operated as in a final application after configuring the IC to performfunctionality specified by a user design), and (4) reads the data in thestorage elements to verify the operation of the circuitry under test. Inthis manner, the method allows a large number of shorter paths to betested in parallel while operating under realistic final applicationconditions.

The primary circuit structure of the configurable IC under test mayinclude, in addition to circuitry such as the configurable logic androuting circuits mentioned above, configurable input/output circuitry,and configuration data storage elements for storing configuration datathat controls the operation of the various configurable circuits of theIC. The configuration/debug network may include various configurableand/or non-configurable circuitry (e.g., logic circuits, storagecircuits, routing circuits, etc.).

The configuration/debug network may be used to write configuration datato the configuration data storage elements in order to control theoperation of the elements included in the primary circuit structure. Theprimary circuit structure may thus be used to create a set ofconfigurable test stimulus generators (alternatively referred to as“launch elements”, “launch circuits”, or “launch sources”). The teststimuli can be generated by logic elements, routing elements, etc. Theoperation of such test stimulus generators may be defined byconfiguration data loaded onto the IC using the configuration/debugnetwork.

The configuration data loaded onto the IC may also be used to control aset of controllable storage elements that are used to store the responseof the circuitry to the test stimuli (such controllable storage elementsare referred to as “capture elements”, “capture circuits”, or “capturedevices”). Configuration data may also be loaded onto the IC in order toprovide a set of test paths that span between the test stimulusgenerators and the storage elements. Such a test method is referred toas “launch-capture” testing.

In addition to configuring the various elements of the primary circuitstructure, the configuration data loaded onto the IC may be used toconfigure the configuration/debug network to access the configurablestorage elements placed within the configurable routing fabric. Theconfiguration/debug network may also be configured to monitor theoperation of the primary circuit structure and/or perform otheroperations

In some embodiments, the capture elements are observable asmemory-mapped resources accessed via a bus. Such a bus may be includedin (or accessed using) the configuration/debug network in someembodiments. The accessibility of these observation nodes is limited bythe address decode of the bus logic, not by the connection ofobservation nodes to external device IOs (e.g., I/O pads, I/O pins,etc.). This allows a very large number of observation nodes to be testedon a particular IC without requiring a large number of test pads orpins. In addition, the bus logic allows multiple capture nodes to beverified simultaneously.

After configuring the primary circuit structure and theconfiguration/debug network, the IC is placed in user mode and a clocksignal is supplied to the IC. The IC is then operated using theconfiguration data previously loaded onto the IC.

To more accurately measure the performance of the shorter test paths,some embodiments operate the IC using a sub-cycle operating scheme,whereby multiple operational sub-cycles (e.g., four, eight, etc.) occurduring each user design cycle. By testing the IC using sub-cycleoperation, signal paths that have delays that are fractions of a userdesign cycle may be used. In addition to testing the circuitry using asub-cycle operating scheme, some embodiments vary the clock frequency orutilize multiple phase-shifted clock signals in order to further reducethe minimum testable duration.

Some embodiments use a single clock source when operating the IC in usermode. The single clock source is used for the test stimulus generators,the test paths, and the storage elements. The minimum delay that can bemeasured in these embodiments is 1/f_(CLK) (i.e., the minimum measurabledelay is defined by a single clock or operation cycle). Thus, forexample, with a 1.6 GHz clock source delays as short as 625 ps can bemeasured.

For greater accuracy when using a single clock source, some embodimentsvary the clock frequency on successive tests (e.g., a test may fail at1.6 GHz but pass at 1.575 GHz). The resolution of such testing islimited by the control accuracy of the clock generator circuits, whichcan be 20 ps or smaller. Achieving such improved resolution requiresadditional test time due to requiring multiple test passes, adjustingthe clock generator circuits, etc.

In order to avoid adjusting the clock frequency during test, someembodiments use multiple clock domains that have a controllable phaserelationship. A first clock domain may be used for the launch element. Asecond clock domain may be used for the capture element. By varying thephase delay of the second clock domain with respect to the first clockdomain, the delay of the circuit can be measured in smaller incrementsthan when using a single clock source. The minimum measurable delay isdetermined by the size of the phase delay. In a typical implementationthis delay can be 70 ps or smaller. As above, the ultimate resolution islimited by the control of the clock phase controller employed by theclock generator circuits.

After operating the IC in user mode, the operation is stopped (e.g., bydisabling the clock signal) and the test results are read out from thecapture elements. The values may be read using the configuration/debugnetwork. The values may then be used to verify the performance of the ICand/or stored for further analysis.

Some embodiments allow more precise measurement of power supplyvariation within an IC. The use of launch-capture testing allows manydelay measurements (e.g., >100,000) to be taken simultaneously within asingle IC. Because very fine resolution delay measurements may be madeat a very large number of locations on the IC, some embodiments mayidentify a group of circuits under test that have increased delay. Thus,the locations of high resistance metal supply connections may beidentified. By analyzing the amount of change in the delay with respectto the typical value the resistance of the metal can be determined.

Measurement of temperature variation within an IC may also be moreaccurately measured using launch-capture testing. The temperature of thedie can be uneven due to flaws in assembly and/or other factors. Hightemperatures cause circuits in the area to have increased delay. Byidentifying a group of circuits under test that have increased delay,the location of high temperature areas of the IC can be identified. Byanalyzing the amount of change in the delay with respect to the typicalvalue, the temperature of each area of the IC can be determined.

Measurement of clock skew within an IC is another parameter that may bemore accurately measured using launch-capture testing. Various circuitsof the IC may be programmed to be driven by different clock sources. Thedifferent clock sources will have varying amounts of clock skew.Comparing delay measurements taken using different clock sources allowsthe skew of the clock sources to be determined.

The preceding Summary is intended to serve as a brief introduction tosome embodiments of the invention. It is not meant to be an introductionor overview of all inventive subject matter disclosed in this document.The Detailed Description that follows and the Drawings that are referredto in the Detailed Description will further describe the embodimentsdescribed in the Summary as well as other embodiments. Accordingly, tounderstand all the embodiments described by this document, a full reviewof the Summary, Detailed Description and the Drawings is needed.Moreover, the claimed subject matters are not to be limited by theillustrative details in the Summary, Detailed Description and theDrawing, but rather are to be defined by the appended claims, becausethe claimed subject matters can be embodied in other specific formswithout departing from the spirit of the subject matters.

DETAILED DESCRIPTION

In the following description, numerous details are set forth for purposeof explanation. However, one of ordinary skill in the art will realizethat the invention may be practiced without the use of these specificdetails. For instance, well-known structures and devices are shown inblock diagram form in order not to obscure the description of theinvention with unnecessary detail.

A method of testing a configurable integrated circuit (“IC”) is providedby some embodiments. Such configurable ICs may have a primary circuitstructure including configurable logic circuits for configurablyperforming logic functions, a configurable routing fabric forconfigurably connecting the circuits of the IC, and/or configurablestorage elements placed throughout the configurable routing fabric forconfigurably storing signals passed along the routing fabric. Inaddition these configurable ICs may have a secondary circuit structureincluding a configuration/debug network (alternatively referred to as a“configuration network” or “debug network”) for configuring theconfigurable circuits of the IC, where the configurable storage elementsand/or other circuit elements are accessible through the configurationnetwork.

In such an environment, the configurable storage elements provideplentiful configurable “capture” elements that are able to store data atvarious points along a test path, thus breaking a long signal path intomultiple smaller paths and allowing micro-granular testing ofsignal-path delay. The data stored by the capture elements may be readout using the configuration/debug network in order to verify theoperation of the IC.

In addition to such capture elements, several configurable logiccircuits (and/or other circuits) provide a number of “launch” elementsthat are able to generate test stimulus, where the stimulus is providedto various circuitry under test. In addition to the launch and captureelements, various other circuitry of the IC (e.g., configurable routingcircuits) provide a set of configurable test paths that connect launchelements and capture elements during test.

The test method (1) loads configuration data to the configurablecircuits to specify the desired operation of the configurable circuitsduring test, (2) configures the configuration/debug network to allowaccess to the desired test points (e.g., capture elements) within theIC, (3) operates the IC in “user” mode to exercise the circuitry (i.e.,operated as in a final application after configuring the IC to performfunctionality specified by a user design), and (4) reads the data in thestorage elements to verify the operation of the circuitry under test. Inthis manner, the method allows a large number of shorter paths to betested in parallel while operating under realistic final applicationconditions.

FIG. 1 illustrates a conceptual process 100 used by some embodiments toperform launch-capture testing of a configurable IC. The process will bedescribed with reference to FIG. 2, which conceptually represents aportion of circuitry in a configurable IC under test. As shown, theprocess generates (at 110) a design for a configurable IC such that thedesign satisfies a set of test criteria. The test criteria for the ICmay be based on verification of operational limits (e.g., propagationdelay of a set of circuits, logical functionality, etc.), failureanalysis (FA) of a section of circuitry of an IC, characterization of ICperformance (e.g., performance over temperature, supply voltage, andprocess variations, etc.), or any other desired evaluation of the IC.Before describing the test methodology in more detail, an exampleconfigurable IC architecture will be described.

FIG. 2 conceptually illustrates such a configurable IC architectureconfigured with a first test design 200 and a second test design 205.The first test design 200 is implemented using the primary circuitstructure of the IC. The IC of FIG. 2 includes numerous configurablecircuits 210 and numerous configurable connections 220 among thecircuits. In this example, the circuits 210 and connections 220 are partof the primary circuit structure. However, the configuration/debugnetwork may also be represented in a similar way. The primary circuitstructure of the configurable IC under test may include, in addition tocircuitry such as the configurable logic and routing circuits (circuits210 and 220 mentioned above), configurable input/output circuitry, andconfiguration data storage elements for storing configuration data thatcontrols the operation of the various configurable circuits of the IC.

The second test design 205 is implemented using the configuration/debugnetwork in addition to the primary circuit structure of the IC. In thisexample, the configuration/debug network is represented as a set ofcommunication pathways 230. However, the configuration/debug network mayinclude various other configurable and/or non-configurable circuitry(e.g., logic circuits, storage circuits, routing circuits, etc.).Furthermore, the second test design 205 illustrates numerousconfigurable storage elements 245 located throughout the IC.

The configuration/debug network 230 may be used to write configurationdata to the configuration data storage elements in order to control theoperation of the elements included in the primary circuit structure. Theprimary circuit structure may thus be used to create a set ofconfigurable test stimulus generators (alternatively referred to as“launch elements”, “launch circuits”, or “launch sources”). The teststimuli can be generated by logic elements, routing elements, etc. Theoperation of such test stimulus generators may be defined byconfiguration data loaded onto the IC using the configuration/debugnetwork.

The configuration data loaded onto the IC may also be used to control aset of controllable storage elements (e.g., elements 245) that are usedto store the response of the circuitry to the test stimuli (suchcontrollable storage elements are referred to as “capture elements”,“capture circuits”, or “capture devices”). Configuration data may alsobe loaded onto the IC in order to provide a set of test paths that spanbetween the test stimulus generators and the storage elements. Such atest method is referred to as “launch-capture” testing.

In addition to configuring the various elements of the primary circuitstructure, the configuration data loaded onto the IC may be used toconfigure the configuration/debug network to access the configurablestorage elements placed within the configurable routing fabric. Theconfiguration/debug network may also be configured to monitor theoperation of the primary circuit structure and/or perform otheroperations.

In some embodiments, the capture elements are observable asmemory-mapped resources accessed via a bus. Such a bus may be includedin (or accessed using) the configuration/debug network in someembodiments. The accessibility of these observation nodes is limited bythe address decode of the bus logic, not by the connection ofobservation nodes to external device IOs (e.g., I/O pads, I/O pins,etc.). This allows a very large number of observation nodes to be testedon a particular IC without requiring a large number of test pads orpins.

In addition, the bus logic allows multiple capture nodes to be verifiedsimultaneously. In some ICs, multiple elements send data to the debugnetwork at the same time. Such ICs may have mask and merge registers tofilter out data from elements that are not being monitored. A moredetailed explanation of such merge and mask registers is provided inU.S. patent application Ser. No. 11/375,562, entitled “AccessingMultiple User States Concurrently in a Configurable IC,” filed on Mar.13, 2006, which is incorporated herein by reference.

The first and second test designs 200 and 205 shown in FIG. 2 illustratethe use of storage elements placed along a test path and used inconjunctions with the configuration/debug network to test theconfigurable IC. In the first test design 200, a long string 225 ofindividual elements 210 is tested at once, as in a typical scan-chaintest implementation. By combining a large number of elements in a singletest path, a greater amount of test coverage is achieved, but testresolution and the ability to isolate elements are sacrificed. Inaddition, the test path 225 may be pre-defined, and thusnon-configurable during test (i.e., the path may not be able to bemodified in real-time based on test results).

In the second test design 205, multiple test paths are defined usinglaunch-capture testing. The second test design 205 shows multiple launchelements 235 that provide stimuli that traverse defined routes 240before reaching multiple capture elements 250. In this example, the testpaths 240 are sections of the test path 225 used in the first testdesign 200. In the second design, various storage elements 245 areavailable throughout the routing fabric of the configurable IC. Asdescribed above, these storage elements may be accessed using theconfiguration/debug network 230.

Different embodiments may generate test designs in different ways. Insome embodiments, the circuitry of the configurable IC is generatedusing electronic design automation (EDA). Some of these embodiments mayuse a hardware description language (HDL) (e.g., Verilog) to provide asoftware description of the circuitry included in the IC. In some ofthese embodiments, the HDL code is automatically examined (e.g., by atool command language (“TCL”) script) to determine a set of routes thatsatisfy the test criteria (e.g., propagation delay for a set ofcircuitry). In some embodiments, the routes may be manually generatedand/or automatically generated based on other data instead of or inconjunction with the analysis of any HDL code.

The routes may be stepped and repeated across an IC that has a repeatingpattern of circuits such that many devices are evaluated during a singletest. FIG. 2 shows one example design 205 where a route 240 is steppedacross multiple locations of the IC. Although in this example, the routeis stepped in a horizontal direction, the route could also be steppedvertically, or at an angle. In addition, the routes could be steppedusing a combination of horizontal, vertical, and/or angular movements.In addition to generating the routes, some embodiments define monitorcircuitry to store the state of the IC at the end of the test cycle,and/or other test circuitry. FIG. 2 shows a set of circuits 260 that arenot being used as launch, capture, or routing circuits, and thus may beused to define the monitor circuitry and/or other test circuitry inexample design 205.

Returning to FIG. 1, after generating (at 110) the design, whichincludes the routes and monitor circuitry, the process generates (at120) test vectors to implement and operate the design. The test vectorsinclude a set of defined logical states and properties for varioussignals. In some embodiments, the test vectors include configurationdata (and control signals for loading the configuration data, clocksignals, etc.), operational data (e.g., clock signals, control signals,etc.), and/or capture commands (i.e., data read operations). These testvectors may be supplied to a set of test hardware that, in turn,supplies the appropriate electrical signals to the IC being tested.

Next, the process loads (at 130) configuration data onto theconfigurable IC using the generated test vectors. This configurationdata defines the operation of the configurable IC such that the routes,monitor circuitry, and/or other test circuitry are implemented using theconfigurable circuits and routing fabric of the IC. The configurationdata is loaded onto configuration data storage elements, which areconnected to the various configurable circuits of the IC. Theconfiguration data may be loaded by using automated test equipment toexecute the appropriate test vectors.

The process then operates (at 140) the configurable IC in user modeusing the generated test vectors. When in user mode, the IC may performvarious logic and routing operations based on the loaded configurationdata and various control signals (e.g., a clock signal, a reset signal,etc.). As above, the configuration data and various control signals maybe provided using automated test equipment to execute the appropriatetest vectors.

In the context of launch-capture testing, operation of the IC in usermode causes a set of launch elements (e.g., launch elements 235) togenerate output data that changes in a particular operation cycle. Eachoutput signal then traverses a path under test (e.g., path 240) untilarriving at the capture element (e.g., capture element 250) associatedwith the launch element producing the output signal. In someembodiments, multiple capture elements may be associated with a singlelaunch element (i.e., multiple capture elements placed along alaunch-capture path may be used to capture data at various points alongthe path, where all the capture data is based on a single stimuluselement).

To more accurately measure the performance of the shorter test paths240, some embodiments operate the IC using a sub-cycle operating scheme,whereby multiple operational sub-cycles (e.g., four, eight, etc.) occurduring each user design cycle. By testing the IC using sub-cycleoperation, signal paths that have delays that are fractions of a userdesign cycle may be evaluated. In addition to testing the circuitryusing a sub-cycle operating scheme, some embodiments vary the clockfrequency or utilize multiple phase-shifted clock signals in order tofurther reduce the minimum testable duration.

Some embodiments use a single clock source when operating the IC in usermode. The single clock source is used for the test stimulus generators,the test paths, and the storage elements. The minimum delay that can bemeasured in these embodiments is 1/f_(CLK) (i.e., the minimum measurabledelay is defined by a single clock or operation cycle). Thus, forexample, with a 1.6 GHz clock source delays as short as 625 ps can bemeasured.

For greater accuracy when using a single clock source, some embodimentsvary the clock frequency on successive tests (e.g., a test may fail at1.6 GHz but pass at 1.575 GHz). The resolution of such testing islimited by the control accuracy of the clock generator circuits, whichcan be 20 ps or smaller. Achieving such improved resolution requiresadditional test time due to requiring multiple test passes, adjustingthe clock generator circuits, etc.

In order to avoid adjusting the clock frequency during test, someembodiments use multiple clock domains that have a controllable phaserelationship. A first clock domain may be used for the launch element. Asecond clock domain may be used for the capture element. By varying thephase delay of the second clock domain with respect to the first clockdomain, the delay of the circuit can be measured in smaller incrementsthan when using a single clock source. The minimum measurable delay isdetermined by the size of the phase delay. In a typical implementationthis delay can be 70 ps or smaller. As above, the ultimate resolution islimited by the control of the clock phase controller employed by theclock generator circuits.

After operating the IC in user mode, the operation is stopped (e.g., bydisabling the clock signal) and the test results are read out from thecapture elements. The values may be read using the configuration/debugnetwork. The values may then be used to verify the performance of the ICand/or stored for further analysis.

Returning to FIG. 1, process 100 then retrieves and stores (at 150) thetest data from the capture elements (e.g., capture elements 250 and/orstorage elements 245). In some embodiments, the test data may includethe logic state of each capture element. As above, the retrieval of testdata may be performed using automated test equipment to execute theappropriate test vectors. In addition, some embodiments store data thatindicates which path was used to generate the test data that is storedin a particular capture element.

Other information may be retrieved and stored with the test data (e.g.,temperature, supply voltage, data identifying the source of the deviceunder test, etc.). The test data may be stored in a single file oracross multiple files. The data may be stored locally on a particulartest system, stored in a database on a central server, or some otherappropriate location. After storing the test data, process 100 ends.

Some embodiments allow more precise measurement of power supplyvariation within an IC. The use of launch-capture testing allows manydelay measurements (e.g., >100,000) to be taken simultaneously within asingle IC. Because very fine resolution delay measurements may be madeat a very large number of locations on the IC, some embodiments mayidentify a group of circuits under test that have increased delay. Thus,the locations of high resistance metal supply connections may beidentified. By analyzing the amount of change in the delay with respectto the typical value the resistance of the metal can be determined.

Measurement of temperature variation within an IC may also be moreaccurately measured using launch-capture testing. The temperature of thedie can be uneven due to flaws in assembly and/or other factors. Hightemperatures cause circuits in the area to have increased delay. Byidentifying a group of circuits under test that have increased delay,the location of high temperature areas of the IC can be identified. Byanalyzing the amount of change in the delay with respect to the typicalvalue, the temperature of each area of the IC can be determined.

Measurement of clock skew within an IC is another parameter that may bemore accurately measured using launch-capture testing. Various circuitsof the IC may be programmed to be driven by different clock sources. Thedifferent clock sources will have varying amounts of clock skew.Comparing delay measurements taken using different clock sources allowsthe skew of the clock sources to be determined.

One of ordinary skill in the art will recognize that process 100 is aconceptual representation of the operations used to performlaunch-capture testing. The specific operations of the process may notbe performed in the exact order described or different specificoperations may be performed in different embodiments. Also, the processmay not be performed as one continuous series of operations. Forinstance, operations 110 and 120 may be performed during testdevelopment, while operations 130-150 may be performed during testingitself. Furthermore, the process could be implemented using severalsub-processes, or as part of a larger macro-process.

Many of the examples given above and below are conceptual examples andare not meant to fully define or limit the environment in which someembodiments of the invention operate. For instance, many examples willuse specific bit counts, numbers of circuits, numbers of I/Os, etc., butdifferent embodiments may be implemented with different specific numbersof such resources (or with the resources arranged in different ways). Inaddition, many examples omit various connections or signals for clarity.For instance, many examples may omit clock signals, control signals,connection paths between circuits, etc. Furthermore, the labels oraccompanying description may indicate that a set of signals has aparticular source (e.g., configuration data) but different embodimentsmay supply the signals from alternative sources (e.g., control signals).

Several more detailed embodiments of the invention are described in thesections below. Section I provides a description of the test environmentused to implement launch-capture testing. Next, Section II describes thelaunch-capture test methodology used by some embodiments at test time.Section III describes various circuits and processes used by someembodiments to isolate faults identified during launch-capture testing.Section IV then describes the generation of test vectors used toimplement launch-capture testing. Lastly, Section V describes a computersystem which implements some of the embodiments of the invention.

I. Test Environment

Typically, IC testing is performed using automated test equipment toprovide power supply and signal stimulus to a device under test. Suchtesting may rely on various hardware and/or software resources.Sub-section I.A describes the IC architecture of devices that are testedby some embodiments. Sub-section I.B then describes the operation of aconfigurable IC, as utilized by some embodiments to perform testfunctions. Sub-section I.C then describes a conceptual test system usedby some embodiments to perform the testing of ICs.

A. IC Architecture

FIGS. 3A-3B conceptually illustrate an example of a configurable IC 300that includes numerous configurable circuits. FIG. 3A shows a conceptualcircuit arrangement for a configurable IC while FIG. 3B shows severaltypes of configurable storage elements that may be placed throughout therouting fabric of the IC. In the example IC shown in FIG. 3A, theconfigurable circuits of the primary circuit structure are arranged assets of circuit elements 305 and a configuration/debug network thatincludes an alternative communication pathway 310 within the IC and atransport network 315 for passing data from the alternativecommunication pathway.

The primary circuit structure includes an array of sets of circuits (or“tiles”) 305, a routing fabric 320 formed by elements of the tilesand/or other circuitry, and configurable I/O circuitry 325 forconnecting the primary circuit structure and/or configuration/debugnetwork to a set of I/O pins 330 for passing signals to and from the IC.Although represented as pins, the I/O pins 330 could be pads (e.g., whenprobing an IC in wafer or die form), solder bumps, and/or other types ofconnections.

In this example, the tiles 305 are arranged in an array of severalaligned rows and columns. Within or outside such a circuit array, someembodiments disperse other circuits (e.g., memory blocks, processors,macro blocks, intellectual property (“IP”) blocks,serializer/deserializer (“SERDES”) controllers, clock management units,etc.). Each tile 305, as shown in breakout section 335, may include setsof configuration data storage elements 340 for storing configurationdata (e.g., a set of SRAM cells) associated with each of theconfigurable circuits of the IC, configurable logic circuits 345 (e.g.,look-up tables (LUTs) 347, input multiplexers (IMUXs) 349, etc.) forconfigurably performing logic operations, configurable routing circuits350 for configurably routing signals, and/or sets of configurablestorage elements 355 for configurably storing signals passed between thevarious circuits of the IC. Different embodiments (or different tiles insome embodiments) have different numbers of each type of circuit.

Sections of the tiles (e.g., the routing circuits 350, and/orconfigurable storage elements 355, etc.) form the configurable routingfabric 320, which is conceptually represented as a set of pathways 337between the tiles 305. The configurable routing fabric may also connectcircuitry within individual tiles, among sets of tiles, between thetiles and the configurable I/O circuitry 325, and/or to other circuitsof the IC. The configurable routing fabric 320 may also include variouswires, buffers, resistors, capacitors, and/or other circuitry.

A routing multiplexer (“RMUX”) 350 is an example of a configurablerouting circuit that at a macro level connects other circuits of the IC.The RMUX includes multiple inputs, one of which is passed to the outputof the RMUX based on signals passed to a set of select lines. The selectlines may be controlled by configuration data, input data, and/or otherdata. Unlike an IMUX that only provides its output to a single logiccircuit (i.e., that only has a fan out of 1), a routing multiplexer insome embodiments may provide its output to several logic, routing,and/or other circuits (i.e., has a fan out greater than 1).

The configurable storage elements 355 are examples of configurablestorage circuitry distributed throughout the IC. Different types ofstorage elements may include different numbers of inputs and/ordifferent numbers of outputs. In addition, different storage elementsmay be controlled by different types of signals (e.g., level-sensitivestorage elements, edge-triggered storage elements, etc.). Furthermore,different storage elements may include various circuitry (e.g., latches,multiplexers, switches, etc.). The storage elements may be accessiblethrough the configuration/debug network 310. A more detailed explanationof such storage elements is provided in PCT Application PCT/US09/33840,entitled “Controllable Storage Elements for an IC,” filed on Feb. 11,2009, which is incorporated herein by reference.

In some embodiments, the logic circuits are look-up tables while therouting circuits (alternatively referred to as “interconnect circuits”)are multiplexers. Also, in some embodiments, the LUTs and themultiplexers are sub-cycle reconfigurable circuits (sub-cycles ofreconfigurable circuits may be alternatively referred to as“reconfiguration cycles”). Reconfigurable IC operation will be describedin more detail in sub-section I.B below. In some of these embodiments,the configurable IC stores multiple sets of configuration data for asub-cycle reconfigurable circuit, so that the reconfigurable circuit canuse a different set of configuration data in different sub-cycles. Otherconfigurable tiles can include other types of circuits, such as memoryarrays instead of logic circuits.

An IMUX 349 is an interconnect circuit associated with the LUT 347 thatmay be in the same tile as the IMUX. Each such IMUX receives severalinput signals for the associated LUT and passes one of these inputsignals to the associated LUT based on the signals supplied to a set ofselect lines. Various wiring architectures can be used to connect theRMUXs, IMUXs, and LUTs.

The secondary circuit structure includes the alternative communicationpathway 310, which may be used to route configuration data to the tiles.Some ICs include a configuration controller for providing configurationdata to the alternative communication pathway. Some embodiments use apacket switching technology to route data to and from the resources inthe configurable tiles. Hence, over the pathway 310, these embodimentscan route variable length data packets to each configurable tile in asequential or random access manner.

In addition, the pathway 310 may be used to route other data among thetiles and/or other circuits of the IC. For instance, the pathway maypass debug data to transport network 315, which in turn passes the debugdata on to other components (not shown). A more detailed explanation ofsuch a transport network is provided in U.S. patent application Ser. No.11/769,680, entitled “Translating a User Design in a Configurable IC forDebugging the User Design,” filed on Jun. 27, 2007, which isincorporated herein by reference.

The secondary circuit structure may also include configurable circuitssuch as logic circuits, storage elements, etc. The secondary circuitstructure may also be used to monitor the primary circuit structure,perform logical operations, etc. In some ICs, the secondary circuitstructure may be arranged in an array of tiles, or some otherappropriate arrangement. Some ICs may include more than two circuitstructures.

In some embodiments, the examples illustrated in FIG. 3A represent theactual physical architecture of a configurable IC. However, in otherembodiments, the examples illustrated in FIG. 3A topologicallyillustrate the architecture of a configurable IC (i.e., theyconceptually show the configurable IC without specifying a particulargeometric layout for the position of the circuits). In some embodiments,the position and orientation of the circuits in the actual physicalarchitecture of a configurable IC are different from the position andorientation of the circuits in the topological architecture of theconfigurable IC. Accordingly, in these embodiments, the IC's physicalarchitecture appears quite different from its topological architecture.

Some embodiments might organize the configurable circuits in anarrangement that does not have all the circuits organized in an arraywith several aligned rows and columns. Therefore, some arrangements mayhave configurable circuits arranged in one or more arrays, while otherarrangements may not have the configurable circuits arranged in anarray. Some embodiments might utilize alternative tile structures and/orcommunication pathways. In addition, some embodiments may test variousdifferent IC architectures. For example, some ICs may include multipledice in one package (i.e., a system-in-a-package implementation). Asanother example, some embodiments may employ a system-on-a-chip designwhereby various functional (and/or physical) elements are manufacturedas separate modules on a single substrate.

FIG. 3B illustrates several examples of different types of configurablestorage elements 375-997 that can be located throughout the routingfabric 360 of a configurable IC. Each storage element 375-397 can becontrollably enabled to store an output signal from a source componentthat is to be routed through the routing fabric to some destinationcomponent. In some embodiments, some or all of these storage elementsare configurable storage elements whose storage operation is controlledby a set of configuration data stored in configuration data storage ofthe IC. U.S. patent application Ser. No. 11/081,859 describes atwo-tiered multiplexer structure for retrieving enable signals on asub-cycle basis from configuration data storage for a particularconfigurable storage. It also describes building the first tier of suchmultiplexers within the output circuitry of the configuration storagethat stores a set of configuration data. Such multiplexer circuitry canbe used in conjunction with the configurable storage elements describedabove and below. U.S. patent application Ser. No. 11/081,859 isincorporated herein by reference.

As illustrated in FIG. 3B, outputs are generated from the circuitelements 365. The circuit elements 365 are configurable logic circuits(e.g., 3-input LUTs and their associated IMUXs as shown in expansion370), while they are other types of circuits in other embodiments. Insome embodiments, the outputs from the circuit elements 365 are routedthrough the routing fabric 360 where the outputs can be controllablystored within the storage elements 375-397 of the routing fabric.Storage element 375 is a storage element that is coupled to the outputof a routing multiplexer. Storage element 380 includes a routing circuitwith a parallel distributed output path in which one of the paralleldistributed paths includes a storage element. Storage elements 385 and390 include a routing circuit with a set of storage elements in which asecond storage element is connected in series or in parallel to theoutput path of the routing circuit. Storage element 395 has multiplestorage elements coupled to the output of a routing multiplexer. Storageelement 397 is a storage element that is coupled to the input of arouting multiplexer.

One of ordinary skill in the art will realize that the depicted storageelements within the routing fabric sections of FIG. 3B only present someembodiments of the invention and do not include all possible variations.Some embodiments use all these types of storage elements, while otherembodiments do not use all these types of storage elements (e.g., someembodiments use only one or two of these types of storage elements).Some embodiments may place the storage elements at locations other thanthe routing fabric (e.g., between or adjacent to the configurable logiccircuits within the configurable tiles of the IC).

B. Configurable IC Operation

In order to control the operation of the IC during each operation cycle(or “sub-cycle”), sets of configuration data are loaded onto the IC.FIG. 4 illustrates the loading of configuration data onto a configurableIC 400 of some embodiments. As shown in this figure, the IC has aconfigurable circuit arrangement 405 and I/O circuitry 410. Theconfigurable circuit arrangement 405 can include any of the abovedescribed circuits (e.g., logic circuits, routing circuits, storageelements, etc.). The I/O circuitry 410 is responsible for routing databetween the configurable elements 415 of the configurable circuitarrangement 405 and circuits outside of this arrangement (i.e., circuitsoutside of the IC, or within the IC but outside of the configurablecircuit arrangement 405). Such I/O circuitry 410 could includecomponents of the primary and/or secondary circuit structures describedabove (e.g., the I/O circuitry 410 may be used to access theconfiguration/debug network).

The data includes in some embodiments sets of configuration data thatconfigure the configurable elements to perform particular operations. Aconfiguration data pool 420 includes N configuration data sets (“CDS”).As shown, the input/output circuitry 410 of the configurable IC 400routes different configuration data sets to different configurableelements 415 of the IC 400. For instance, FIG. 4 illustratesconfigurable element 445 receiving configuration data sets 1, 3, and Jthrough the I/O circuitry, while configurable element 450 receivesconfiguration data sets 3, K, and N−1 through the I/O circuitry. In someembodiments, the configuration data sets are stored within eachconfigurable element. Also, in some embodiments, a configurable elementcan store multiple configuration data sets for a configurable circuitwithin it so that this circuit can reconfigure quickly by changing toanother configuration data set for a configurable circuit. In someembodiments, some configurable elements store only one configurationdata set, while other configurable elements store multiple such datasets for a configurable circuit.

Some embodiments are implemented in a configurable IC that hasreconfigurable circuits that reconfigure (i.e., base their operation ondifferent sets of configuration data) one or more times during theoperation of the IC. Specifically, these ICs are configurable ICs thatcan reconfigure during runtime (or user mode). These ICs typicallyinclude reconfigurable logic circuits and/or reconfigurable interconnectcircuits, where the reconfigurable logic and/or interconnect circuitsare configurable logic and/or interconnect circuits that can“reconfigure” more than once at runtime. A configurable logic orinterconnect circuit reconfigures when it bases its operation on adifferent set of configuration data.

A reconfigurable circuit of some embodiments that operates on four setsof configuration data receives its four configuration data setssequentially in an order that repeatedly loops from the firstconfiguration data set to the last configuration data set. Such asequential reconfiguration scheme is referred to as a 4 “loopered”scheme. Other embodiments, however, might be implemented as six or eightloopered sub-cycle reconfigurable circuits. In a six or eight looperedreconfigurable circuit, a reconfigurable circuit receives six or eightconfiguration data sets in an order that repeatedly loops from the lastconfiguration data set to the first configuration data set.

FIG. 5 conceptually illustrates an example set of operations of an ICthat includes circuits that are sub-cycle reconfigurable (i.e., an ICthat includes circuits that are reconfigurable on a sub-cycle basis).Specifically, FIG. 5 shows one of the sub-cycle reconfigurable circuitsof the IC that iteratively performs four sets of operations 510-540.This figure illustrates the reconfigurable circuit reconfiguring fourtimes during four operation sub-cycles. During each of thesereconfigurations (i.e., during each sub-cycle), the reconfigurablecircuit performs one of the identified four sets of operations.Different embodiments may utilize more or fewer sub-cycles (e.g., 2, 6,or 8 sub-cycles). Each sub-cycle of such an IC with reconfigurablecircuits may be used to initiate a particular test action, such ascausing a transition in the output of a launch element and/or readingthe state of a capture element.

A more detailed explanation of such sub-cycle operation and therelationship between sub-cycles and user design cycles is provided inU.S. patent application Ser. No. 11/081,823, entitled “ConcurrentOptimization of Physical Design and Operational Cycle Assignment,” filedon Mar. 15, 2005.

C. Test System

FIG. 6 illustrates an automated test system 600 that is used toimplement launch-capture testing in some embodiments. Specifically, thisfigure shows the use of the test system to retrieve test instructionsand vectors, provide stimulus to a specific device under test 610 basedon the retrieved instructions and vectors, and store the results of thetesting. As shown, the test system includes a test control engine 620for directing the operations of the test system 600, a set of devicedrivers 630 for providing stimulus to the device under test, and a setof measurement devices 640 for retrieving data from the device undertest. In addition, the test system 600 may interface to the device undertest through device-specific test hardware 650. The device-specific testhardware may include various device drivers, measurement devices, and/orcontrollable connection paths that route signals to the I/O pins of thedevice under test and/or receive signals from the I/O pins of the deviceunder test.

The test system 600 may also have access to a set of storages. Thesestorages may include storage for test software 660, test vectors 665,test data 670, and/or other data 675. In some embodiments these storages660-675 (and/or other storages) may be included locally in the testsystem 600, while in other embodiments, the test system may access thestorages through a network connection (not shown).

The test system performs test operations based on a particular set oftest software associated with a particular device under test (or type ofdevice under test). The test control engine 620 loads test software fromstorage 660. The test software controls the sequence of operationsperformed by the test control engine 620 and directs the measurement andstorage of the test results. Based on the test software, the testcontrol engine 620 may load a set of test vectors specified by the testsoftware from storage 665. These test vectors define the state(s) ofcontrol signals, stimulus data, data capture, etc. that will be appliedto the device under test. The generation and use of test vectors will bedescribed in more detail in Section IV below.

The test control engine 620 may then send a set of signals to the devicedrivers 630, which in turn generate electrical signals that are suppliedto the device under test 610. In some embodiments, these signals arepassed through device-specific hardware 650 before reaching the deviceunder test 610. The device under test then performs operations inresponse to the supplied signals. The outputs of these operations arethen returned to the test control engine 620 through the set ofmeasurement devices 640. In some embodiments, these outputs are passedthrough device-specific hardware 650 before reaching the measurementdevices 640. The measurement devices convert the received electricalsignals into test data that may be processed by the test control engine620. This test data may then be stored in storage 670.

In some cases, the test control engine 620 (based on the test software)will conditionally perform operations based on the received test data.For instance, when a test fails, the test software may direct the testcontrol engine to end testing of the device under test. As anotherexample, the test software may direct the test control engine to performa different set of tests or sequence of tests based on the results ofprevious test data.

Although the conceptual test system 600 has been described withreference to certain specific details, one of ordinary skill in the artwill recognize that different embodiments may use different specificimplementations of such a test system. For instance, some or all of thetest operations may be controlled by a user (e.g., a test engineer, testoperation, technician, etc.) instead of, or in conjunction with, thetest software. As another example, the physical device(s) under test maybe automatically connected to the test system 600 by an automated devicesuch as a package handler or wafer prober. Such an automated device mayalso at least partially direct the operation of the automated testsystem (e.g., by directing the test system to start test operationsafter a device is loaded). In addition, different embodiments of thetest system 600 may include various other modules and/or connections,multiple modules may be combined to form a single module, and/or asingle module may be broken up into several sub-modules. Furthermore, asthe test system 600 is a conceptual representation, one of ordinaryskill will understand than actual implementation may include differentsignals, interfaces, storages, resources, etc. that are used toimplement the functionality described above.

II. Launch-Capture Test Methodology

The following section describes the test methodology used by someembodiments to perform launch-capture testing. Sub-section II.A gives anoverview of the launch-capture test methodology. Sub-section II.B thendescribes several clocking schemes used by some embodiments to achieveimproved accuracy. Sub-section II.C follows that discussion with adetailed description of launch-capture testing implementation includingthe launch-capture test process and example launch-capture test circuit.

A. Overview

FIG. 7 conceptually illustrates a launch-capture circuit 700 as used toevaluate a section of IC circuitry in some embodiments. Specifically,this figure shows a single test route and the elements along its path.In this conceptual example, the path defining the launch-capture circuit700 has been previously designed and the IC configured as describedabove in sub-section I.B. In addition, the IC has been placed in usermode and the clock has been enabled. These actions may be performedusing a test system such as that described above in sub-section I.C.

As shown, the launch-capture circuit 700 includes a launch element 710for providing a test stimulus, circuitry under test 720 for respondingto the stimulus, a capture element 730 for storing the results of thetest, a set of connections 740 for routing signals among the variouselements, and various signal lines 750 for passing signals (e.g.,control signals, configuration signals, address signals, commandsignals, etc.) to the elements 710-730 of the launch-capture circuit700. In addition, this figure shows a portion of the configuration/debugnetwork 760 used for accessing the value stored in the capture element730.

During operation of the launch-capture circuit, the signal lines 750supply various clock, control, and/or other signals that allow the IC tooperate in user mode. The signals passed along the signal lines may besupplied by a resource such as the automated test system 600 describedabove in reference to FIG. 6 and/or other resources (e.g., a logicanalyzer, a computer system through an appropriate interface, customtest hardware, etc.). Alternatively or conjunctively, the signals passedalong the signal lines may be generated by the IC.

The launch element 710 reacts to the supplied signals and provides atest stimulus including one or more signals to the circuitry under test720. In some embodiments, the launch element may be one or more LUTs,storage elements, multiplexers, or some other circuitry of the IC thatis capable of providing a changing output.

The circuitry under test 720 receives the stimulus from the launchcircuit and performs various operations based on the received stimulusand the supplied signals 750. The circuitry under test may includevarious circuit elements of the IC (e.g., storage elements, routingelements, wires and other pathways, etc.). In some embodiments, thecircuitry under test may include elements from a single tile of the IC,elements spread across multiple tiles, and/or elements from otherregions of the IC (e.g., elements from the secondary circuit structure,the configurable I/O circuitry, etc.). After processing the receivedstimulus, the circuitry under test 720 passes one or more output signalsto the capture element 730.

The capture element receives the output of the circuitry under test 720and stores the received output based on one or more of the suppliedsignals 750. In some embodiments, the capture element may be a latchthat is controlled by a configuration data set. The configuration dataset causes the latch to hold data in all but one operation cycle (e.g.,in all reconfiguration cycles except one) and pass data in the remainingoperation cycle. The value stored in the latch thus indicates whether aparticular stimulus reached the end of the test route during thatoperation cycle in which the latch was open (i.e., when passing data).This value may then be retrieved (e.g., by an automated test system suchas test system 600) for analysis using the configuration/debug network760.

Although the conceptual circuit above was described with reference tocertain features, one of ordinary skill will recognize that differentembodiments may implement the launch-capture circuitry in various otherspecific ways. For example, the launch-capture circuit may includeseveral capture elements for each launch element. As another example,the configuration/debug network may include other connections to thevarious circuits in test circuit 700. A more detailed description of thelaunch-capture circuitry with several specific examples will be providedin sub-section II.C below.

B. Clock Schemes for Improved Measurement Resolution

When using a single clock domain (i.e., all signals are based on asingle clock), the minimum delay resolution that may be tested isequivalent to 1/f_(CLK), where f_(CLK) represents the frequency of theclock used to drive the IC in user mode (i.e., one sub-cycle period isthe best resolution that may be achieved when using a single clocksource). This is because both the launch and capture elements of aparticular launch-capture circuit are driven by signals that aresynchronized with the single clock. Several different approaches may beused to achieve improved test resolution. Some example ways of improvingthe minimum delay resolution are described below. Although the examplesthat follow show clock signals with a 50% duty cycle, differentembodiments may use different clock signals with varying duty cycles.

FIG. 8 illustrates several example clock signals 810-840 used by someembodiments. Specifically, this figure shows a timing diagram 800 thatillustrates the timing relationships among various clock signals. Asshown, the timing diagram includes a first clock signal 810 having afrequency f₁, a second clock signal 820 having a frequency f₂, a thirdclock signal 830 having a frequency f₁ and a phase shift PS₁ withrespect to the first clock signal 810, and a fourth clock signal 840having a frequency f₁ and a phase shift PS₂ with respect to the firstclock signal 810. Each of the clock signals 810-840 may be used to clocksome or all of the circuits of the IC. One of ordinary skill in the artwill recognize that the clock signals 810-840 are conceptualrepresentations of the actual signals. The actual signals may havevarying duty cycles, slew rates, and/or other attributes. In addition,the phase relationships between the various signals are not drawn toscale and actual implementations may have various different phaserelationships between signals, as needed.

When a single clock domain (e.g., the clock domain defined by clocksignal 810) is used in conjunction with a test circuit such aslaunch-capture test circuit 700, the minimum test path delay is a singleperiod of the clock, corresponding to one operation cycle of the IC(regardless of whether the operation cycle is a user design cycle or asub-cycle). This minimum test path delay or resolution results becausethe minimum difference in time between a launch signal and a capturesignal is one clock period when both signals are based in the same clockdomain.

In order to improve the resolution of the delay measurement when using asingle clock domain, some embodiments operate the IC using sub-cyclesrather than user design cycles when testing the IC. For furtherimprovement, some embodiments vary the operating frequency of the IC byvarying the frequency of the clock signal. For instance, if a particulartest fails at a clock frequency of 1.6 GHz, the test may be re-run at aclock frequency of 1.575 MHz. In this manner, the resolution may beimproved to the difference between the clock period at each testedfrequency. For instance, in this example, the clock period of the 1.6GHz clock is 625 ps while the clock period of the 1.575 GHz is 635 ps.Thus, the resolution may be improved from 625 ps to 10 ps by adjustingthe frequency of the clock signal. Varying the clock frequency mayrequire re-locking a phase-locked loop (PLL) that generates the clocksignals.

Some embodiments, in order to avoid re-locking the PLL and re-runningthe same test at multiple frequencies, instead use multiple clockdomains. FIG. 9 illustrates one example of a launch-capture circuit 900of some embodiments that uses multiple clock domains. As shown, thelaunch-capture circuit 900 includes the same elements and signals710-750 described above in reference to FIG. 7. In addition, the launchelement 710 receives signals 910 that are based in a launch clockdomain, while the capture element 730 receives signals that are based ina capture clock domain.

A launch-capture circuit that uses multiple clock domains may achieveimproved resolution based on the relationship of the launch clock andthe capture clock. Referring to FIG. 8, the third clock signal 830 maybe used as a launch clock while the fourth clock signal 840 may be usedas a capture clock. In this manner, the minimum resolution is defined bythe phase shift between the third clock signal 830 and the fourth clocksignal 840. The minimum phase shift in some embodiments is defined by1/(2*f_(VCO)), where f_(VCO) is the maximum frequency of a voltagecontrolled oscillator (VCO) used by the PLL. Thus, for example, aresolution of 70 ps may be achieved when using a 7.2 GHz VCO withouthaving to re-lock the PLL or re-run the test. Some embodiments maycombine the techniques, and use phase-shifted clocks in conjunction withtesting using multiple frequencies (i.e., re-locking the PLL), thusachieving better resolution than either technique used individually.

The use of multiple clock domains provides many potential advantages inaddition to improved resolution. For instance, the ability to measureshorter delays allows for shorter test paths which are then easier tostep and repeat. In addition, shorter paths reduce the effects ofaveraging among elements under test. Furthermore, the shorter pathssimplify the isolation of failing elements. In addition, multiple clockdomains allow the use of launch elements other than LUTs. Because of theincreased availability of launch elements, more resources may be testedin parallel. Because of the increased resolution, clock speed becomesless important to the definition of the test path, thus allowing thetest to be performed at various clock frequencies in order to vary powerconsumption (and any associated heat dissipation of the IC).

FIG. 10 illustrates one example circuit 1000 that may be used togenerate phase-shifted clock signals in some embodiments. Specifically,this figure shows a PLL generating a particular output that isphase-shifted by different amounts to generate multiple output signalsthat are equal in frequency, but offset in phase. In this example, theclock generation circuit includes a PLL 1010 for generating a signalthat has the same phase and frequency (or multiple of the frequency) asan input reference signal, and multiple phase shift elements 1020 for,based on various phase shift control signals 1025, generating signalsthat are phase-shifted with respect to the PLL output 1030.

Referring again to FIG. 8, the clock generation circuit 1000 may be usedto generate clock signals such as signals 810, 830, and 840. Forinstance, clock signal 810 may be provided by the output 1030 of the PLL1010. Similarly, clock signal 830 may be provided by the output 1040 ofa particular phase shift element 1020 that generates a relatively smallamount of phase shift. Likewise, clock signal 840 may be provided by theoutput 1050 of a particular phase shift element 1020, which, in thisexample, has a greater amount of phase shift than output 1040. By usingdifferent sets of outputs 1040-1060 of phase shift elements 1020, alaunch-capture test circuit that operates across multiple clock domains(e.g., launch-capture test circuit 900) different resolutions may beachieved.

In addition, the clock generation circuit 1000 may be used toiteratively adjust the phase shift of any individual output 1040-1060 inorder to achieve improved measurement resolution without having tore-lock the PLL 1010 and without having to select among differentoutputs 1040-1060. For instance, continuing the example above, in someembodiments, the phase shift of clock signal 830 and/or clock signal 840(as provided by outputs 1040-1050) may be adjusted by changing the phaseshift control signal 1025 of either or both phase shift elements 1020that produce the clock signals 830-840. In this manner, the phaserelationship between the clock signals 830-840 may be varied withoutre-locking the PLL 1010 and without altering the connection scheme usedto supply the clock signals.

One of ordinary skill in the art will recognize that the clockgeneration circuit 1000 is a conceptual example, and actualimplementations may include various other elements, signals, and/orconnections than those shown. For instance, the PLL may receive variouscontrol signals (e.g., range, reset, enable, etc.). As another example,different embodiments may provide different numbers of phase-shiftedoutputs than those shown (e.g., 4, 16, or 32 outputs).

C. Testing Implementation

1. Test Flow

FIG. 11 illustrates a conceptual process 1100 used by some embodimentsto perform launch-capture testing of an IC. Such a process may be atleast partially implemented using a test system such as the automatedtest system 600 described above in reference to FIG. 6. In addition, theprocess may be used to test a configurable IC such as the IC 300described above in reference to FIGS. 3A-3B. Process 1100 will bedescribed with reference to FIGS. 3 and 6.

The process begins when an IC is ready to be tested. In someembodiments, a signal from a handler, prober, or other such equipmentmay indicate that a device is ready to be tested. In other embodiments,a signal may be generated manually (e.g., when a user of a test systempresses a “start test” button).

After receiving a command to test a particular IC, the process loads (at1110) test software onto a test system, such as automated test system600. In some cases (e.g., when another IC has been previously testedusing the same test software), operation 1110 is skipped to achievegreater efficiency. The test software may be loaded from a storage suchas test software storage 660.

After loading (at 1110) the software, the process selects (at 1120) thenext test vector (or set of vectors) to execute. The selection of testvectors may be controlled by the test software loaded at 1110.Alternatively, in some embodiments, the choice of test vector may bemade manually (e.g., when an engineer or technician is debugging aparticular test setup or particular IC).

Next, the process configures (at 1130) the IC being tested, using thetest vector selected at 1120. The configuration may be performed byloading configuration data to the IC using the alternative communicationpathway 310. The configuration data may be loaded in a similar manner tothat described above in reference to FIG. 4. In addition to providingconfiguration data to the IC, the test vector may specify varioussignals that direct the operation of the IC during configuration (e.g.,clock signal(s), control signal(s), enable signal(s), etc.).Furthermore, in addition to logical signals, the test system 600 mayprovide other types of signals (e.g., reference voltages, supplyvoltages, etc.).

After configuring (at 1130) the IC under test, the process cycles (at1140) the IC in user mode. Cycling the IC in user mode may beaccomplished by using the test vector loaded at 1120 to supply thenecessary clock and/or control signals such that the IC is able tooperate in user mode. While operating in user mode, various launchelements provide various test stimulus signals and various captureelements store the results of the stimulus signal(s) traversing thepath(s) under test. The amount of time operating in user mode (and,consequently, the number of operation cycles that are executed) isdetermined by the signals provided by the test vector and/or the numberof cycles through the test vector.

After cycling (at 1140) the IC in user mode, the process reads (at 1150)test results from the capture elements. Again, the signals defined bythe test vector may be used to access the results stored by the captureelements. In some embodiments, the capture elements are read using thealternative communication pathway 310. Alternatively, and/orconjunctively, the test results may be read using the primary circuitstructure of some embodiments.

Next, the process determines (at 1160) whether there is another testvector to execute. When the process determines that there is anothertest vector to execute, the process returns to operation 1120. When theprocess determines that there is not another test vector to execute, theprocess stores (at 1170) the test results and ends. In some cases, thedetermination of whether to execute another test vector may be based onthe results of a previously-executed test vector. For instance, when anIC fails a particular test, the test software may determine that thepart has failed testing, and end the testing of that IC. As anotherexample, when an IC fails a particular test, the test software maydirect the test system to execute a set of test vectors to characterizethe failure, where the set of test vectors is not normally executedunless an IC fails the particular test. In other cases, the processexecutes all test vectors as directed by the test software, withoutregard to the results of testing with any previously-applied testvectors.

One of ordinary skill in the art will recognize that process 1100 is aconceptual representation of the operations used to performlaunch-capture testing. The specific operations of the process may notbe performed in the exact order described or different specificoperations may be performed in different embodiments. Also, the processmay not be performed as one continuous series of operations.Furthermore, the process could be implemented using severalsub-processes, or as part of a larger macro-process. For instance, someembodiments may implement process 1100 as a sub-set of a complete testsequence. In other words, the test sequence may include testing otherthan that achieved using test vectors. For example, the complete testsequence may include various analog measurements, such as supply currentmeasurements, leakage current measurements, etc.

2. Exemplary Launch-Capture Test Circuits

FIG. 12 illustrates one example of a launch element 1200 of someembodiments. Specifically, this figure shows a launch element thatprovides a stimulus to circuitry under test. As shown, the launchelement includes a set of configuration data storage elements 1210 forstoring configuration data, a multiplexer 1220 for selecting among theconfiguration data storage elements, a sub-cycle counter 1230 fortracking the current operation cycle, and a routing multiplexer 1240 forproviding a stimulus to the circuit under test.

In some embodiments, each configuration data storage element 1210 storesconfiguration data corresponding to a particular operation sub-cycle. Inthis example, there are eight bits of data, corresponding to eightrepeating operation cycles (i.e., an 8-loopered design). The multiplexer1220 selects from among the various configuration data elements based ona set of select signals received from the sub-cycle counter 1230 (inthis example, the counter has three output bits because there are eightinputs to the multiplexer). The sub-cycle counter of some embodimentsgenerates the select signals by incrementing the counter value each timea rising clock edge is received at the clock input of the sub-cyclecounter. The output of the multiplexer 1220 drives the selection controlof the routing multiplexer 1240. In this manner, the routing multiplexerselects among its inputs based on the output value of the multiplexer1240. Because the inputs to the routing multiplexer are tied to logic 1and logic 0, each time the selection signal changes logic value, theoutput of the routing multiplexer changes as well. The logic 0 and logic1 inputs can come from any source that can provide a constant value(e.g., LUTs, storage elements, supplies, etc.).

In this example, the configuration data storage elements 1210 forsub-cycles zero, one, two, and three are programmed to 0 while theconfiguration memory data storage elements for sub-cycles four, five,six, and seven are programmed to a 1. The sub-cycle counter 1230 isinitially reset to 000. In response, the multiplexer 1220 selects port 0so the multiplexer 1220 output is driven to 0. The selection input torouting multiplexer 1240 is 0 so the output is driven by Logic 0. AsSCclk pulses are applied to the sub-cycle counter the output incrementsfrom 000 to 111 before wrapping back to 000, at which point the sequencerepeats.

When the output of the sub-cycle counter is 000, 001, 010, or 011, therouting multiplexer 1240 select input is 0 and the routing multiplexeroutput is Logic 0. When the sub-cycle counter output becomes 100 themultiplexer 1220 output becomes 1 because the multiplexer is nowselecting a configuration data storage element that has been programmedto 1. The routing multiplexer output will now transition to Logic 1because routing multiplexer selection input is now 1. Every time thatthe sub-cycle counter changes from 011 to 100 the routing multiplexeroutput changes from Logic 0 to Logic 1. Every time that the sub-cyclecounter changes from 111 to 000, the routing multiplexer output changesfrom Logic 1 to Logic 0. Each of the transitions of the output of therouting multiplexer can be used as a stimulus launch edge.

FIG. 13 illustrates another example of a launch element of someembodiments. Specifically, this example shows the use of a LUT 1300 as alaunch element. The launch element includes multiple sets ofconfiguration data elements 1310 for storing configuration data, severalmultiplexers 1320 for selecting among the configuration data storageelements, a sub-cycle counter 1330 for tracking the current operationcycle, and a routing multiplexer 1340 for providing a stimulus to thecircuit under test. In this example, the configuration data storageelements have been programmed such that the output of the launch elementwill transition from 0 to 1 when the sub-cycle counter transitions from011 to 100 and the output will transition from 1 to 0 when the sub-cyclecounter transitions from 111 to 000. Some embodiments may supplydifferent sets of configuration data to each of the multiplexers 1320.In this manner, the stimulus may be changed based on the select inputsto the routing multiplexer 1340, allowing for greater flexibility whendesigning a test solution.

FIG. 14 illustrates an example of a capture element 1400 of someembodiments. Specifically, this example shows the use of a configurablestorage element 1410 as a capture element. The capture element 1400includes a set of configuration data elements 1420 for storingconfiguration data, a multiplexer 1430 for selecting among theconfiguration data storage elements, a sub-cycle counter 1440 fortracking the current operation cycle, and the configurable storageelement 1410 for capturing the response of the circuitry under test. Theresponse corresponds to a particular stimulus to the circuitry undertest. In this example, when the EN pin of the storage element 1410 is 1the storage element operates as a transparent latch, where the output ofthe latch is the same as the D input to the latch. When the EN pin is 0the storage element 1410 is closed and the output of the storage elementmaintains its current state. The state of the EN pin is controlled bythe output of the multiplexer 1430. The select inputs of the multiplexerare driven by the sub-cycle counter 1440.

In this figure, the configuration data storage elements for sub-cycleszero, one, two, three, five, six, and seven are programmed to 0. Theconfiguration data storage element for sub-cycle four is programmed toa 1. The sub-cycle counter is initially reset to 000, causing themultiplexer 1430 to select port 0 so the output is driven to the stateof configuration data element 0, which is a 0. When the output of thesub-cycle counter is 100 the EN pin of the storage element 1410 is setto 1 and the output of storage element is the state of circuit undertest. When the sub-cycle counter is not 100, the EN pin of storageelement is set to 0 and the storage element maintains its current state.Thus, when the output of the sub-cycle counter transitions from 100 to101, the EN pin of the storage element transitions from 1 to 0 and thestorage element will maintain the state that the circuit under test wasat just before the output of the sub-cycle counter became 101. Thisvalue will be maintained until the next capture cycle (i.e., sub-cyclefour in this example). Thus, if the clock is stopped when the output ofthe sub-cycle counter is not 100 then the state of storage element canbe read and will reflect the value of the circuit under test in responseto the most recent stimulus.

FIG. 15 illustrates another example of a capture element 1500 of someembodiments. Specifically, this example shows the use of a clockedstorage element 1510 as a capture element. The capture element includesthe clocked storage element 1510 for capturing the response of thecircuitry under test, and a clock signal for clocking the clockedstorage element. The response corresponds to a particular stimulus tothe circuitry under test. In this example, when the SCclk signaltransitions from 0 to 1, the clocked storage element captures the valuesupplied by the circuit under test. At all other times, the clockedstorage element maintains its current state. In some cases, the clockedstorage element may update its output when the SCclk signal transitionsfrom 1 to 0. The SCclk signal is the same signal that drives varioussub-cycle counters as described above in reference to FIGS. 12-14. Insome embodiments, the value stored in clocked storage element 1510 isonly valid for one sub-cycle (i.e., the value stored on a rising clockedge may change at the next rising clock edge) and the operation of thedevice must be stopped in that sub-cycle in order to read valid testdata from the storage element.

FIG. 16 illustrates an exemplary launch-capture test circuit 1600 and anassociated state table 1610 of some embodiments. Specifically, thisfigure shows the connections and states of various elements along alaunch-capture test path. The launch-capture test circuit includes a LUT1620 for providing a test stimulus, circuitry under test 1630-1660 forperforming a set of operations based on the test stimulus, a storageelement 1670 for capturing the response of the circuitry under test tothe test stimulus, and a configuration retrieval circuitry (alsoreferred to as space-time context switcher) 1680 for supplyingconfiguration data to the various elements of the test circuit 1600through a set of communication pathways 1690. In addition, this figureshows a portion of the configuration/debug network 760 used foraccessing the value stored in storage element 1650 and/or storageelement 1670.

The state table 1610 describes the state of each element in thelaunch-capture test circuit 1600 for each sub-cycle of operation (inthis example, there are four sub-cycles). The operation of the circuit1600 when in user mode (i.e., when the circuit is under test) will nowbe described, under the assumption that each element in the circuitfunctions properly. As shown, the LUT 1620 output is 0 in all sub-cyclesexcept sub-cycle two, when the LUT output is 1. The LUT output serves asthe launch stimulus for the circuit 1600. Thus, when the LUT transitionsfrom 0 to 1 in sub-cycle two, the circuitry under test (i.e., circuitelements 1630-1660) responds to the transition.

RMUX 1 1630 has been configured to select input a4 in each sub-cycle(i.e., the input connected to the LUT 1620 output). Thus, when theoutput of the LUT changes, the signal on the output of RMUX 1 changes totrack the change on the input of RMUX 1. Likewise, the transition ispropagated through RMUX 2 1640, which is selecting the input connectedto the RMUX 1 output (i.e. the “a3” input). SE 1 1650, which is “open”(i.e., transparently passing data from its input to its output) in allsub-cycles, receives the output of RMUX 2 and provides that value to theinput of RMUX 3 1660. RMUX 3, which is selecting the input connected tothe output of SE 1 (i.e., the “a4” input), in turn passes the valuereceived at its input to SE 2 1670.

SE 2 functions as the capture element in this circuit 1600. Thus, SE 2is “closed” (i.e., holding previously-stored data) for each sub-cycleexcept sub-cycle two. During sub-cycle two, SE 2 is open and able torespond to the stimulus provided during sub-cycle two. At the end ofsub-cycle two, SE 2 is closed, thus storing the results of thelaunch-capture test. The data stored in SE 2 is thus valid if the testis stopped in any sub-cycle except sub-cycle two.

FIG. 17 illustrates another exemplary launch-capture circuit 1700 and anassociated state table 1705 of some embodiments. Specifically, thisfigure shows the connections and states of various elements along alaunch-capture test path that uses signals from multiple clock domains.This figure provides a more detailed example of the multiple-clockdomain launch-capture circuit described above in reference to FIGS. 8and 9.

The launch-capture test circuit includes a LUT 1710 for providing aparticular output state (e.g., 1), a storage element 1715 for providinga different output state (e.g., 0), an RMUX 1720 for generating a teststimulus, other circuitry under test 1725-1735 for performing a set ofoperations based on the test stimulus, a storage element 1740 forcapturing the response of the circuitry under test to the test stimulus,and multiple sources 1745-1755 of space-time data (each source from adifferent clock domain) for supplying configuration data (and/or otherdata) to the various elements of the test circuit 1700 through a set ofcommunication pathways. In addition, this figure shows a portion of theconfiguration/debug network 760 used for accessing the value stored instorage element 1730 and/or storage element 1740.

The state table 1705 describes the state of each element in thelaunch-capture test circuit 1700 for each sub-cycle of operation (inthis example, there are eight sub-cycles). The operation of the circuit1700 when in user mode (i.e., when the circuit is under test) will nowbe described, under the assumption that each element in the circuitfunctions properly. As shown, the LUT 1710 output is 1 in all sub-cycleswhile the output of storage element SE 1 1715 is 0 in all sub-cycles.The LUT 1710 and SE 1 1715 provide their output signals to the inputs tothe RMUX 1 1720 launch element.

RMUX 1 1720 is programmed to pass the value on input a4 (i.e., theoutput of LUT 1710) during sub-cycles zero through three, and the valueon input a6 (i.e., the output of SE 1 1715) during sub-cycles fourthrough seven. In this example, the launch element is driven by signalsfrom the Launch CLK domain 1745. In some embodiments, the signalscontrolling the operation of RMUX 1 may be generated using a circuitsuch as sub-cycle counter 1230 described above in reference to FIG. 12.In these embodiments, the input to the sub-cycle counter may be one ofthe phase-shifted clock signals (e.g., Launch CLK 830 from FIG. 8)instead of the SCclk signal, while the SCclk signal (i.e., the non-phaseshifted signal) may be used to generate the signals for the Any CLKdomain 1755. The RMUX 1 output serves as the launch stimulus for thecircuit 1700. Thus, when the output transitions from 1 to 0 in sub-cyclefour, the circuitry under test (i.e., circuit elements 1725-1735)responds to the transition.

RMUX 2 1725 has been configured to select input a3 in each sub-cycle(i.e., the input connected to the RMUX 1 1720 output). Thus, when theoutput of RMUX 1 changes, the signal on the output of RMUX 2 changes totrack the change on the input of RMUX 2. Likewise, the transition ispropagated through SE 2 1730, which is “open” (i.e., transparentlypassing data from its input to its output) in all sub-cycles, andreceives the output of RMUX 2 and provides that value to the input ofRMUX 3 1735. RMUX 3, which is selecting the input connected to theoutput of SE 2 (i.e., the “a4” input), in turn passes the value receivedat its input to SE 3 1740.

SE 3 functions as the capture element in this circuit 1700. Thus, SE 3is closed for each sub-cycle except sub-cycle four. During sub-cyclefour, SE 3 is open and able to respond to the stimulus provided duringsub-cycle four. At the end of sub-cycle four, SE 3 is closed, thusstoring the results of the launch-capture test. The data stored in SE 3is thus valid if the test is stopped in any sub-cycle except sub-cyclefour. In this example, the capture element is driven by signals from theCapture CLK domain 1750. In some embodiments, the signals controllingthe operation of SE 3 may be generated using a circuit such as sub-cyclecounter 1230 described above in reference to FIG. 12. In theseembodiments, the input to the sub-cycle counter may be one of thephase-shifted clock signals (e.g., Launch CLK 840 from FIG. 8) insteadof the SCclk signal, while the SCclk signal (i.e., the non-phase shiftedsignal) may be used to generate the signals for the Any CLK domain 1755.

In some ICs, the storage element 1715 providing data to an RMUX (e.g.,RMUX 1720) may be a configuration data storage element (i.e., a storageelement that stores configuration data that has been previously loadedto the IC). The RMUX connected to the configuration data storage elementmay include many minimum width transistors, which are subject to moretransistor-to-transistor variation than transistors that are wider thanthe minimum width. For this reason, when testing such ICs, someembodiments test the delay of each RMUX included in the IC.

In addition, the configuration memory access logic of these ICs mayinclude many minimum width transistors. Thus, when testing such ICs,some embodiments test the delay from each configuration data storageelement through the access logic and RMUX connected to the output of theconfiguration data storage element. The use of separate clock domains asdescribed above, allows more accurate testing of these elements (becausefewer other elements are included in the same test path). By improvingthe timing resolution that is able to be tested, the delay through moreelements is able to be tested in parallel, which greatly increasesefficiency because only the first RMUX in the path may be tested forthis delay, as all other RMUXs will be relative to some unknownpropagation delay of the circuits that precede those RMUXs in the testpath.

FIG. 18 illustrates another exemplary launch-capture circuit 1800 and anassociated state table 1810 of some embodiments. Specifically, thisfigure shows a variation of the launch-capture circuit 1700 where thecapture element is a clocked storage element. The launch-capture testcircuit 1800 includes a LUT 1710 for providing a particular output state(e.g., 1), a storage element 1715 for providing a different output state(e.g., 0), an RMUX 1720 for generating a test stimulus, other circuitryunder test 1725-1735 for performing a set of operations based on thetest stimulus, a clocked storage element 1820 for capturing the responseof the circuitry under test to the test stimulus, and multiple sources1745-1755 of space-time data (each source from a different clock domain)for supplying configuration data (and/or other data) to the variouselements of the test circuit 1800 through a set of communicationpathways. In addition, this figure shows a portion of theconfiguration/debug network 760 used for accessing the value stored inthe capture element 1820.

The launch-capture circuit 1800 functions in a similar manner tolaunch-capture circuit 1700 described above, except for the operation ofthe clocked storage element 1820. The clocked storage element iscontrolled by a clock signal 1830 from the Capture CLK domain 1750. Inthis example, the capture CLK is stopped during sub-cycle four, thuspreserving the captured value in the clocked storage element until theend of sub-cycle seven. In this example, the capture CLK is re-startedin sub-cycle zero (and thus the data in the clocked storage element isno longer valid for purposes of the test), however different embodimentsmay enable and disable the launch CLK signal during differentsub-cycles.

One of ordinary skill in the art will recognize that while the variouscircuits described above in reference to FIGS. 12-18, differentembodiments may implement such circuits in different ways withoutdeparting from the spirit of the invention. For instance, differentimplementations might include different individual elements in the testpath, different connections between those elements (and/or otherelements of the IC), different sets of signals being supplied to thoseelements, etc.

For example, although FIG. 16 shows configuration data being supplied toall circuit elements by a single configuration retrieval circuitry 1680,some embodiments may include such a configuration retrieval circuitry ateach circuit element (or supply one configuration retrieval circuitryfor a sub-set of the circuit elements). As another example, thesecircuits have been shown as single instances, but may be repeated acrossan IC to provide greater test coverage (e.g., the repeatinglaunch-capture test circuits described above in reference to FIG. 2). Asyet another example, not all circuits or pathways may be representedcompletely. For instance, the storage elements 1650 and 1670 may includemultiple inputs and/or outputs, and/or include connections to and/orfrom circuitry or communication that is not shown in FIG. 16.

3. Data Validation

In some embodiments, the operation of the IC may be enabled and/ordisabled asynchronously to the supplied sub-cycle clock when the IC isbeing tested in user mode. Such asynchronous operation may make itdifficult to ascertain which sub-cycle was active when the IC isdisabled. Because many launch-capture test circuits only produce validtest data in a sub-set of the operation cycles, it may be criticallyimportant to determine in which sub-cycle the IC ended operation and,thus, whether a particular capture element holds valid data.

FIG. 19 illustrates one example monitor circuit 1900 that may be used insome embodiments to determine in which sub-cycle the IC under test endedoperation. Specifically, this figure shows the use of existingconfigurable circuitry of the IC to monitor and store the currentoperating sub-cycle of the IC. As shown, the monitor circuit includes aset of three LUTs 1910 that together are for determining the currentoperating cycle of the IC, three storage elements 1920 for controllablystoring data, each storage element associated with a particular LUT, anda sub-cycle counter 1930 for tracking the current operation cycle. Sucha monitor circuit may be implemented using available configurablecircuitry of the IC (e.g., using the set of circuits 260 as describedabove in reference to FIG. 2).

The sub-cycle counter 1930 receives a sub-cycle clock signal. Thesub-cycle counter increments the count at every clock cycle. The threeoutputs of the sub-cycle counter thus indicate the current operationsub-cycle in some embodiments. These outputs are supplied to each of theLUTs 1910, directing each LUT to provide data corresponding to thecurrent sub-cycle. Each LUT then supplies its output to a storageelement 1920. The storage elements may be controlled in such a way as tostore the values being output by the LUTs during each clock cycle. Insome embodiments, the storage elements may be controlled by a signalthat is asynchronous to the SCclk signal.

In this example, the monitor circuit includes three bits, correspondingto an eight sub-cycle design. For instance, a three bit value of 000(each bit corresponding to the output of one of the LUTs 1910) mayidentify the sub-cycle as sub-cycle 0 while a value of 101 may identifythe sub-cycle as sub-cycle 5. Different embodiments may includedifferent numbers of bits (e.g., two bits for a four sub-cycle design,four bits for a sixteen sub-cycle design, etc.).

FIG. 20 illustrates a conceptual process 2000 that may be used by someembodiments to control sub-cycle monitor circuitry such as that shown inFIG. 19. Process 2000 could be performed as a sub-process of process1100 described above in reference to FIG. 11. Process 2000 will bedescribed with reference to FIG. 19 but one of ordinary skill willrecognize that the process could be performed with (and/or by) variousother circuit arrangements. The process begins, in some embodiments,when the IC begins operating in user mode. The process may determinethat the IC is operating in user mode by determining whether the SCclksignal being supplied to the sub-cycle counter 1930 is changing.Different embodiments may determine that the IC is operating in usermode in different ways. For instance, some embodiments may receive atrigger signal from a test system indicating that the IC is operating inuser mode. As another example, some embodiments may receive anindication from the IC (e.g., an output signal provided by the IC) thatthe IC is operating in user mode.

After determining that the IC is being operated in user mode, theprocess determines (at 2010) whether a new sub-cycle of operation hasbeen detected. In some cases, this determination may include receiving aparticular transition (e.g., from 0 to 1) on the clock signal SCclk thatis being supplied to the sub-cycle counter 1930. In other cases, atrigger signal or other indication of a new sub-cycle may be provided oravailable.

When the process determines (at 2010) that a new sub-cycle of operationhas been detected, the process opens (at 2020) storage elementsindicating the current sub-cycle (e.g., storage elements 1920), updates(at 2030) the monitor circuitry (e.g., by updating the value output fromthe sub-cycle counter 1930, which in turn causes the values output bythe LUTs 1910 to be updated), and closes (at 2040) the storage elementsthat hold the value of the current sub-cycle (e.g., storage elements1920).

When the process determines (at 2010) that no new sub-cycle of operationhas been detected, the process determines (at 2050) whether the IC isstill operating in user mode. This determination may be made in asimilar manner to that described above in reference to the start ofprocess 2000. When the process determines (at 2050) that the IC is stilloperating, the process performs operation 2010 as described above. Whenthe process determines (at 2050) that the IC is not still operating, theprocess reads (at 2070) the storage elements to determine the sub-cycleof operation in which the IC was disabled and then ends.

One of ordinary skill in the art will recognize that process 2000 is aconceptual representation of the operations used to determine the lastoperating sub-cycle of the IC under test. The specific operations of theprocess may not be performed in the exact order described or differentspecific operations may be performed in different embodiments. Also, theprocess may not be performed as one continuous series of operations.Furthermore, the process could be implemented using severalsub-processes, or as part of a larger macro-process. For instance, someembodiments may implement process 2000 as a sub-set of operations withina test sequence.

III. Fault Isolation

Some configurable ICs include storage elements at the output of most ofthe LUTs, at the output of most RMUXs, and/or at other locations withinthe IC. These storage elements may be read in some embodiments toisolate failure locations along a path (this process is alternativelyreferred to as “fault isolation”). In some cases, the placement of thestorage elements allows fault detection at an elemental level. Inaddition, some embodiments may further examine a particular failingelement to determine which specific paths, transistors, and/or othersub-elements of the failing element are malfunctioning.

FIG. 21 illustrates an exemplary launch-capture test circuit 2100 ofsome embodiments that includes the elements of launch-capture circuit1600 of FIG. 16 with additional components to enable fault isolation. Inaddition to the components and operations described above in referenceto FIG. 16, the launch-capture test circuit 2100 includes two additionalstorage elements 2110 and 2120 for storing the state at certainconnections of the launch-capture test circuit 2100.

As shown, the output of LUT 1620 is connected to storage element SE 32110, while the output of RMUX 1 1630 is connected to storage element SE4 2120. The values in these storage elements may be used to determinewhether RMUX 1 is functioning properly. When the value in SE 3 matchesthe value in SE 4, that indicates that RMUX 1 is functioning properly(i.e., that RMUX 1 is passing the value from the selected input to itsoutput). When the value in SE 3 does not match the value in SE 4, thatindicates that RMUX 1 is not functioning properly.

In addition to including elements SE 3 and SE 4 to determine whetherRMUX 1 is functioning properly, some embodiments may include multipleother storage elements within the circuit 2100. For example, someembodiments may include a storage element at the output of each element1620-1670 of the circuit 2100, thus allowing verification of eachelement along the tested path.

When determining that a particular element along a path is notfunctioning properly, different embodiments may perform different setsof operations. One conceptual process for responding to a determinationthat a particular element is not functioning properly is described belowin reference to FIG. 24.

FIG. 22 illustrates an example of a circuit 2200 that may be furtherevaluated in some embodiments when the circuit has been determined to bemalfunctioning. Specifically, this figure shows additional paths thatmay be tested when determining that a particular circuit element (e.g.,an RMUX) is malfunctioning. In this example, the RMUX may be any RMUXalong a test path, where storage elements at the input and output of theRMUX (not show) have indicated that the RMUX is non-functional.

The circuit 2200 includes an RMUX 2210 that has been determined to bemalfunctioning, and several paths 2220-2240 for routing input signals tothe RMUX. In this example, each path includes two buffers, however theinput paths may include various different elements, such as wires,buffers, delay elements, etc.

Once the RMUX 2210 has been determined to be malfunctioning, by, forexample, testing the RMUX in a launch-capture test circuit using path2220, further testing may be performed to further isolate themalfunction. For example, by supplying test stimulus to the other inputpaths 2230-2240 of the RMUX, one or more individual transistors (and/orconnections) that make up the multiplexer may be identified asmalfunctioning. For example, if only one input to the RMUX fails, thatmay indicate that a transistor and/or connection unique to that inputhas caused the malfunction. Whereas if two or more inputs fail, that mayindicate that either several transistors and/or connections (i.e., atransistor and/or connection associated with each failing input) havemalfunctioned or that a single transistor and/or connection shared byall of the failing inputs has malfunctioned.

FIG. 23 illustrates a transistor-level example of using fault isolationto identify a failing path or transistor within a malfunctioning element2300. Specifically, this figure shows the use of fault isolation toidentify specific failing transistors. As shown, the malfunctioningelement 2300 includes two transistors 2310 and 2320 for selectingbetween two inputs 2330 and 2340 to the element 2300 and a cross-coupledpair of pull-up transistors 2350 and 2360 each for driving a particularoutput 2370 or 2380 of the element 2300.

By alternatively enabling the input transistors 2310 and 2320, eachtransistor may be individually verified as functional or malfunctioning.Such testing may be performed on multiple other inputs or connections ofa malfunctioning element.

If a difference in timing between a 0 to 1 transition and a 1 to 0transition is encountered, it may indicate that a particular pull-up(and/or pull-down) path is slow. In this example, by individuallyenabling one or more inputs connected to path 2370 and one or moreinputs connected to path 2380 (not shown), each pull-up transistor 2350or 2360 may be individually verified as functional or malfunctioning.Similar testing may be performed on other similar circuit elements.

FIG. 24 illustrates a conceptual process 2400 for performing faultisolation analysis in some embodiments. Such a process may be used toexamine a device during IC testing, failure analysis, devicecharacterization, device qualification, etc. For example, process 2400could be performed as a sub-process of process 1100 described above inreference to FIG. 11. Process 2400 will be described with reference toFIGS. 21-23. The process begins when a malfunction occurs. Themalfunction may be identified when performing test of an IC, duringend-use of the IC, or some other way. In particular, the malfunction mayidentify a failing circuit element, such as the RUMX 1630 identified asmalfunctioning when the values in the storage elements 2110 and 2120 donot match.

Once a particular malfunctioning element is identified, the processdetermines (at 2410) whether there are other, untested inputs to themalfunctioning element. When there are, the process evaluates (at 2420)each of the previously untested inputs. The evaluation of these inputsmay require such actions as loading and executing test vectors on anautomated test system. In some embodiments, the process may evaluate asub-set of available inputs based on various criteria, such as test dataanalysis. The evaluation of inputs may be performed, for example, whenexamining circuitry as described above in reference to input paths2220-2340 of RMUX 2210, or inputs 2330-2340 of element 2300.

After evaluating the inputs or determining (at 2410) that there are nountested inputs, the process next determines (at 2430) whether there areuntested outputs. When there are, the process evaluates (at 2440) eachof the untested outputs. In some embodiments, based on various criteria,the process may evaluate a sub-set of the available outputs. Theevaluation of outputs may be performed, for example, when examiningcircuitry as described above in reference to transistors 2350 and 2360connected to outputs 2370 and 2380, respectively, of element 2300.

Next, the process determines (at 2450) if there are other relevantproperties of the element that may be tested (e.g., transition from a 1to 0 when the element previously failed a transition from a 0 to 1,selecting a different launch element, selecting a different captureelement, etc.). When there are, the process evaluates (at 2460) thoseproperties or a sub-set of those properties. When the process determines(at 2450) that there are no other properties to evaluate, the processends.

One of ordinary skill in the art will recognize that process 2400 is aconceptual representation of the operations used to perform faultisolation. The specific operations of the process may not be performedin the exact order described or different specific operations may beperformed in different embodiments. For instance, in addition to theoperations described above, the process may decompose a particularelement or pathway into sub-elements and/or shorter pathways andevaluate those sub-elements or shortened paths. Also, the process maynot be performed as one continuous series of operations. Furthermore,the process could be implemented using several sub-processes, or as partof a larger macro-process.

IV. Generation of Test Vectors

FIG. 25 illustrates a conceptual process 2500 used by some embodimentsto generate a set of test vectors to be used when performinglaunch-capture testing. The process will be described with reference toFIG. 26.

FIG. 26 illustrates a conceptual diagram showing one possibleimplementation of a launch-capture test generation module 2600.Specifically, this figure shows one example module that may be used togenerate a set of test vectors to perform launch-capture testing. Such amodule may be used in conjunction with a set of IC design tools (e.g.,extraction tools, placement and routing tools, etc.). As shown, themodule includes a path evaluation engine 2610 for examining configurableIC design information and a vector generation engine 2620 for creating aset of test patterns. In addition, the module has access to a set ofother IC design tools 2630 for performing various IC design operations,an IC design storage 2640 for storing various IC design information, avector storage 2650 for storing test vectors, and/or other storages 2660for storing various information.

The process starts by accessing a set of IC design tools. The processthen explores (at 2510) the configurable fabric of the IC (i.e., theconfigurable elements of the IC) that will be tested, in order toidentify and design a set of routes that meet certain target criteria.In some embodiments, this exploration of the configurable fabric may beperformed by a module such as the path evaluation engine 2610 afterloading an abstract representation of a configurable IC design from theIC design storage 2640 and a set of test criteria from the otherstorages 2660.

In some embodiments, the process may automatically explore theconfigurable fabric of the IC using a script (e.g., by using a TCLscript to interface with an extraction tool). The target criteria may becriteria such as minimum and/or maximum delay time, minimum and/ormaximum number of elements in a path, various performance criteria, etc.In addition, the target criteria may include avoiding routing throughresources with multiple input sources, routing through elements thathave not been tested by previously-design routes, etc. Furthermore, thetarget criteria may specifically target particular circuitry and/orregions of the IC for certain types of analysis. These identified routesmay be designed using a module such as the vector generation engine2620, which generates the appropriate test vectors to configure thedesigned paths of an IC under test.

Next, the process uses (at 2520) a placer and router to step thedesigned test route across the IC. In some embodiments, the placer androuter and stepper are TCL-based operations. In some cases, thelaunch-capture test generation module 2600 may automatically directother IC design tools 2630 to perform such an operation. Stepping thedesigned route across the IC allows parallel testing of a vast amount ofIC resources. As above, the vector generation engine 2620 may generate(or add to existing) test vectors that will configure an IC under test.

The process then adds (at 2530) monitor functions to the test design.These monitor functions may include functionality such as monitoring thesub-cycle of operation described above in reference to FIG. 19. Next,the process saves (at 2540) data regarding the designed path. This datamay include information such as the number of elements in the path, theIC for which the path was designed, launch element, capture element,etc.

Next, the process identifies (at 2550) the storage elements along thedesigned test route. Some embodiments may identify these storageelements using a script to automatically evaluate the designed path. Insome embodiments, this identification of storage elements may beperformed by a module such as the path evaluation engine 2610 using thepreviously-loaded configurable IC design.

The process then programs (at 2560) the identified storage elements.This programming is conceptual (i.e., the storage elements are notprogrammed until an IC is being tested), and consists of generating (oradding to existing) test vectors. These test vectors may be generatedusing a module such as the vector generation engine 2620. The storageelements are programmed such that the elements along the test path areall open (or transparent) while the capture elements are open during thetransition cycle and closed during all others. In some cases, suchprogramming may include programming a clock signal to stop during acertain sub-cycle (e.g., when a clocked storage element is used as acapture element).

The process then generates (at 2570) or adds to test vectors such thatthe test vectors include signals to put the IC into user mode, enablethe clock, wait (and collect test data), and disable the clock. Thegeneration of or addition to test vectors may be performed by a modulesuch as the vector generation engine 2620.

The process then reads (at 2570) all capture storage elements to collectthe generated test data. In some embodiments, this data is alsovalidated by determining the sub-cycle when operation was disabled (andthe sub-cycle of valid data for that capture element). As above, thereading of the storage elements occurs at run-time by executing a set oftest vectors. These test vectors may be generated by a module such asthe vector generation engine 2620. These test vectors (and other testvectors generated by process 2500) may be stored in a storage such asvector storage 2650. In some embodiments, the test vectors that read thecapture elements include explicit comments that identify the tested pathassociated with each capture element.

One of ordinary skill in the art will recognize that process 2500 is aconceptual representation of the operations used to generate testvectors. The specific operations of the process may not be performed inthe exact order described or different specific operations may beperformed in different embodiments. For instance, in addition to theoperations described above, the process may decompose a particularelement or pathway into sub-elements and/or shorter pathways andevaluate those sub-elements or shortened paths. Also, the process maynot be performed as one continuous series of operations. Furthermore,the process could be implemented using several sub-processes, or as partof a larger macro-process.

V. Computer System

Many of the above-described processes, methods, and modules areimplemented as software processes that are specified as a set ofinstructions recorded on a computer readable storage medium (alsoreferred to as “computer readable medium” or “machine readable medium”).When these instructions are executed by one or more computational orprocessing element(s), such as processors or other computationalelements like Application-Specific ICs (“ASIC”) and Field ProgrammableGate Arrays (“FPGA”), they cause the computational element(s) to performthe actions indicated in the instructions. Computer is meant in itsbroadest sense, and can include any electronic device with computationalelements a processor. Examples of computer readable media include, butare not limited to, CD-ROMs, flash drives, RAM chips, hard drives,EPROMs, etc. The computer readable media does not include carrier wavesand/or electronic signals passing wirelessly or over wired connections.

In this specification, the term “software” includes firmware residing inread-only memory or applications stored in magnetic storage which can beread into memory for processing by one or more processors. Also, in someembodiments, multiple software inventions can be implemented assub-parts of a larger program while remaining distinct softwareinventions. In some embodiments, multiple software inventions can alsobe implemented as separate programs. Finally, any combination ofseparate programs that together implement a software invention describedherein is within the scope of the invention. In some embodiments, thesoftware programs when installed to operate on one or more computersystems define one or more specific machine implementations that executeand perform the operations of the software programs.

FIG. 27 conceptually illustrates a computer system 2700 with which someembodiments of the invention are implemented. For example, the systemdescribed above in reference to FIG. 6 may be at least partiallyimplemented using sets of instructions that are run on the computersystem 2700. As another example, the processes described in reference toFIGS. 24 and 25 may be at least partially implemented using sets ofinstructions that are run on the computer system 2700.

Such a computer system includes various types of computer readablemediums and interfaces for various other types of computer readablemediums. Computer system 2700 includes a bus 2710, a processor 2720, asystem memory 2730, a read-only memory (ROM) 2740, a permanent storagedevice 2750, input devices 2770, output devices 2780, and a networkconnection 2790. The components of the computer system 2700 areelectronic devices that automatically perform operations based ondigital and/or analog input signals.

One of ordinary skill in the art will recognize that the computer system2700 may be embodied in other specific forms without deviating from thespirit of the invention. For instance, the computer system may beimplemented using various specific devices either alone or incombination. For example, a local PC may include the input devices 2770and output devices 2780, while a remote PC may include the other devices2710-2750, with the local PC connected to the remote PC through anetwork that the local PC accesses through its network connection 2790(where the remote PC is also connected to the network through a networkconnection).

The bus 2710 collectively represents all system, peripheral, and chipsetbuses that communicatively connect the numerous internal devices of thecomputer system 2700. In some cases, the bus 2710 may include wirelessand/or optical communication pathways in addition to or in place ofwired connections. For example, the input devices 2770 and/or outputdevices 2780 may be coupled to the system 2700 using a wireless localarea network (W-LAN) connection, Bluetooth®, or some other wirelessconnection protocol or system.

The bus 2710 communicatively connects, for example, the processor 2720with the system memory 2730, the ROM 2740, and the permanent storagedevice 2750. From these various memory units, the processor 2720retrieves instructions to execute and data to process in order toexecute the processes of the invention. In some embodiments theprocessor includes an FPGA, an ASIC, or various other electroniccomponents for execution instructions.

The ROM 2740 stores static data and instructions that are needed by theprocessor 2720 and other modules of the computer system. The permanentstorage device 2750, on the other hand, is a read-and-write memorydevice. This device is a non-volatile memory unit that storesinstructions and data even when the computer system 2700 is off. Someembodiments of the invention use a mass-storage device (such as amagnetic or optical disk and its corresponding disk drive) as thepermanent storage device 2750.

Other embodiments use a removable storage device (such as a floppy disk,flash drive, or CD-ROM) as the permanent storage device. Like thepermanent storage device 2750, the system memory 2730 is aread-and-write memory device. However, unlike storage device 2750, thesystem memory 2730 is a volatile read-and-write memory, such as a randomaccess memory (RAM). The system memory stores some of the instructionsand data that the processor needs at runtime. In some embodiments, thesets of instructions used to implement the invention's processes arestored in the system memory 2730, the permanent storage device 2750,and/or the read-only memory 2740. For example, the various memory unitsinclude instructions for processing multimedia items in accordance withsome embodiments.

The bus 2710 also connects to the input devices 2770 and output devices2780. The input devices 2770 enable the user to communicate informationand select commands to the computer system. The input devices includealphanumeric keyboards and pointing devices (also called “cursor controldevices”). The input devices also include audio input devices (e.g.,microphones, MIDI musical instruments, etc.) and video input devices(e.g., video cameras, still cameras, optical scanning devices, etc.).The output devices 2780 include printers, electronic display devicesthat display still or moving images, and electronic audio devices thatplay audio generated by the computer system. For instance, these displaydevices may display a GUI. The display devices include devices such ascathode ray tubes (“CRT”), liquid crystal displays (“LCD”), plasmadisplay panels (“PDP”), surface-conduction electron-emitter displays(alternatively referred to as a “surface electron display” or “SED”),etc. The audio devices include a PC's sound card and speakers, a speakeron a cellular phone, a Bluetooth® earpiece, etc. Some or all of theseoutput devices may be wirelessly or optically connected to the computersystem.

Finally, as shown in FIG. 27, bus 2710 also couples computer system 2700to a network 2790 through a network adapter (not shown). In this manner,the computer can be a part of a network of computers (such as a localarea network (“LAN”), a wide area network (“WAN”), an Intranet, or anetwork of networks, such as the Internet. For example, the computersystem 2700 may be coupled to a web server (network 2790) so that a webbrowser executing on the computer system 2700 can interact with the webserver as a user interacts with a GUI that operates in the web browser.

Some embodiments include electronic components, such as microprocessors,storage and memory that store computer program instructions in amachine-readable or computer-readable media (alternatively referred toas computer-readable storage media, machine-readable media, ormachine-readable storage media). Some examples of such computer-readablemedia include RAM, ROM, read-only compact discs (CD-ROM), recordablecompact discs (CD-R), rewritable compact discs (CD-RW), read-onlydigital versatile discs (e.g., DVD-ROM, dual-layer DVD-ROM), a varietyof recordable/rewritable DVDs (e.g., DVD-RAM, DVD-RW, DVD+RW, etc.),flash memory (e.g., SD cards, mini-SD cards, micro-SD cards, etc.),magnetic and/or solid state hard drives, read-only and recordableblu-ray discs, ultra density optical discs, any other optical ormagnetic media, and floppy disks. The computer-readable media may storea computer program that is executable by a device such as an electronicsdevice, a microprocessor, a processor, a multi-processor (e.g., an ICwith several processing units on it) and includes sets of instructionsfor performing various operations. The computer program excludes anywireless signals, wired download signals, and/or any other ephemeralsignals.

Examples of hardware devices configured to store and execute sets ofinstructions include, but are not limited to, ASICs, FPGAs, programmablelogic devices (“PLDs”), ROM, and RAM devices. Examples of computerprograms or computer code include machine code, such as produced by acompiler, and files including higher-level code that are executed by acomputer, an electronic component, or a microprocessor using aninterpreter.

As used in this specification and any claims of this application, theterms “computer”, “server”, “processor”, and “memory” all refer toelectronic or other technological devices. These terms exclude people orgroups of people. For the purposes of this specification, the termsdisplay or displaying mean displaying on an electronic device. As usedin this specification and any claims of this application, the terms“computer readable medium” and “computer readable media” are entirelyrestricted to tangible, physical objects that store information in aform that is readable by a computer. These terms exclude any wirelesssignals, wired download signals, and/or any other ephemeral signals.

It should be recognized by one of ordinary skill in the art that any orall of the components of computer system 2700 may be used in conjunctionwith the invention. Moreover, one of ordinary skill in the art willappreciate that any other system configuration may also be used inconjunction with the invention or components of the invention.

While the invention has been described with reference to numerousspecific details, one of ordinary skill in the art will recognize thatthe invention can be embodied in other specific forms without departingfrom the spirit of the invention. For example, several embodiments weredescribed above by reference to particular media editing applicationswith particular features and components (e.g., particular compositedisplay areas). However, one of ordinary skill will realize that otherembodiments might be implemented with other types of media editingapplications with other types of features and components (e.g., othertypes of composite display areas).

Moreover, while the examples shown illustrate certain individual modulesas separate blocks (e.g., the path evaluation engine 2610, the vectorgeneration engine 2620, etc.), one of ordinary skill in the art wouldrecognize that some embodiments may combine these modules into a singlefunctional block or element. One of ordinary skill in the art would alsorecognize that some embodiments may divide a particular module intomultiple modules.

One of ordinary skill in the art will realize that, while the inventionhas been described with reference to numerous specific details, theinvention can be embodied in other specific forms without departing fromthe spirit of the invention. For instance, alternate embodiments may beimplemented using different specific test hardware configurations. Oneof ordinary skill in the art would understand that the invention is notto be limited by the foregoing illustrative details, but rather is to bedefined by the appended claims.

I claim:
 1. An integrated circuit (IC) comprising: a plurality ofconfigurable circuits; and a configuration data storage for providingdifferent sets of configuration data in different clock cycles to theplurality of configurable circuits, wherein each set of configurationdata is for (i) configuring the plurality of configurable circuits toperform operations of a user design, (ii) generating test stimulus fortesting the plurality of configurable circuits, and (iii) capturing testresult of said testing from the plurality of configurable circuits. 2.The IC of claim 1, wherein the user design operates according to a userdesign clock having a user design cycle, wherein each of the differentclock cycles is a sub-cycle of the user design cycle.
 3. The IC of claim1, wherein each clock cycle correspond to a reconfiguration cycle,wherein the configuration data storage stores a plurality of sets ofconfiguration data, each set of configuration data for a differentreconfiguration cycle.
 4. The IC of claim 3, wherein the IC furthercomprises a reconfiguration counter for selecting a set of configurationdata stored in the configuration data storage, wherein each count of thereconfiguration counter correspond to a different reconfiguration cycle.5. The IC of claim 3, wherein the plurality of configurable circuitsreconfigures every reconfiguration cycle to perform an operationaccording to the set of configuration data provided in thatreconfiguration cycle.
 6. The IC of claim 3, wherein the configurationdata comprises control signals for enabling storage elements to capturethe result of said testing at a particular reconfiguration cycle.
 7. TheIC of claim 1, wherein the test stimulus is generated at a first clockdomain and the test result is captured at a second, different clockdomain.
 8. A method for testing an integrated circuit (IC) comprising aplurality of configurable circuits, the method comprising: for eachclock cycle: retrieving, a set of configuration data from aconfiguration data storage for the clock cycle; and providing theretrieved sets of configuration data of the clock cycle to the pluralityof configurable circuits for (i) configuring the plurality ofconfigurable circuits to perform an operations of a user design, (ii)providing test stimulus for testing the plurality of configurablecircuits, and (iii) capturing test result of said testing from theplurality of configurable circuits.
 9. The method of claim 8, whereinthe user design operates according to a user design clock having a userdesign cycle, wherein each reconfiguration clock cycles is a sub-cycleof the user design cycle.
 10. The method of claim 8, wherein each clockcycle correspond to a reconfiguration cycle, wherein the configurationdata storage stores a plurality of sets of configuration data, each setof configuration data for a different reconfiguration cycle.
 11. Themethod of claim 10, wherein the plurality of configurable circuitsreconfigures every reconfiguration cycle to perform an operationaccording to the set of configuration data provided in thatreconfiguration cycle.
 12. The method of claim 10, wherein theconfiguration data comprises control signals for enabling storageelements to capture the result of said testing at a particularreconfiguration cycle.
 13. The method of claim 8, wherein the teststimulus is generated at a first clock domain and the test result iscaptured at a second, different clock domain.
 14. A method for testingan integrated circuit (IC) comprising a plurality of configurablecircuits, the method comprising: providing sets of configuration data tothe IC, each set of configuration data corresponds to a differentreconfiguration cycle; and enabling the IC to perform operations basedon the provided sets configuration data, wherein in each reconfigurationcycle the corresponding set of configuration data is for (i) configuringthe plurality of configurable circuits to perform operations of a userdesign, (ii) generating test stimulus for testing the plurality ofconfigurable circuits, and (iii) capturing test result of said testingfrom the plurality of configurable circuits.
 15. The method of claim 14,wherein the user design operates according to a user design clock havinga user design cycle, wherein each reconfiguration cycle is a sub-cycleof the user design cycle.
 16. The method of claim 14, wherein the ICcomprises a reconfiguration counter for selecting a set of configurationdata, wherein each count of the reconfiguration counter correspond to adifferent reconfiguration cycle.
 17. The method of claim 14, wherein theplurality of configurable circuits reconfigures every reconfigurationcycle to perform an operation according to the set of configuration dataprovided in that reconfiguration cycle.
 18. The method of claim 14,wherein the configuration data comprises control signals for enablingstorage elements to capture the result of said testing at a particularreconfiguration cycle.
 19. The method of claim 14, wherein the teststimulus is generated at a first clock domain and the test result iscaptured at a second, different clock domain.